


TT Electronics/IRC
GS8B011022CT
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GS8B011022CT Description
GS8B011022CT Description
The GS8B011022CT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 16-pin narrow SOIC package, this bussed (BUS) configuration integrates 15 thin-film resistors, each with a 10.2KΩ resistance and an exceptional ±0.25% tolerance. The device operates over a wide temperature range (-70°C to +125°C) with a ±100ppm/°C temperature coefficient, ensuring stability in harsh environments. Its 0.05W (1/20) power rating per resistor and 100V maximum voltage rating make it suitable for precision analog and digital circuits. The SOIC-C series construction features a rectangular ceramic case with gull-wing terminations, optimized for surface-mount (SMD) assembly.
GS8B011022CT Features
- High Precision: ±0.25% absolute tolerance and ±100ppm/°C TCR for critical signal conditioning.
- Robust Construction: Ceramic substrate enhances thermal performance and durability.
- Space-Efficient: Compact 9.91mm × 5.99mm × 1.45mm footprint with 1.27mm terminal pitch.
- Bussed Design: Simplified PCB layout with shared connections for bus applications.
- Wide Operating Range: Derated power up to 125°C, ideal for industrial/automotive-grade systems (though not PPAP/automotive certified).
- Non-RoHS Compliant: Suitable for legacy or specialized applications requiring leaded components.
GS8B011022CT Applications
- Analog Signal Processing: Voltage dividers, DAC/ADC reference networks.
- Industrial Controls: PLCs, sensor interfaces, and instrumentation requiring stable resistance.
- Telecommunications: Line termination, impedance matching in high-frequency circuits.
- Power Management: Current sensing, feedback loops in DC-DC converters.
- Legacy Systems: Maintenance or upgrades for non-RoHS-compliant designs.
Conclusion of GS8B011022CT
The GS8B011022CT excels in precision and reliability, leveraging thin-film technology and ceramic packaging for superior performance in thermally challenging environments. While not suited for automotive or RoHS-restricted designs, its tight tolerances, bussed architecture, and high-voltage capability make it a standout choice for industrial, telecom, and precision electronics. Engineers will appreciate its balance of miniaturization, thermal resilience, and ease of integration in space-constrained layouts.



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