TT Electronics/IRC

GS8B011101JCT

GS8B011101JCT Description

The GS8B011101JCT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. Housed in a 16-pin narrow SOIC package, this bussed network integrates 15 thin-film resistors, each with a 1.1kΩ resistance and a ±5% absolute tolerance. The device operates over a wide temperature range of -70°C to +125°C, with a ±100ppm/°C temperature coefficient, ensuring stable performance under thermal stress. Its 0.05W (1/20) power rating per resistor and 0.8W total power dissipation make it suitable for low-power circuits, while the 100V maximum voltage rating adds robustness. The gull-wing termination and surface-mount design facilitate easy PCB integration.

GS8B011101JCT Features

• Ceramic substrate for enhanced thermal stability and durability.
• Thin-film technology delivers precise resistance values with ±0.25% ratio tolerance, ideal for matched impedance applications.
• SOIC package (9.91mm x 5.99mm x 1.45mm) with tight tolerances (±0.1mm height, ±0.2mm depth) ensures consistent footprint compatibility.
• Bussed configuration simplifies circuit design by connecting multiple resistors to a common node (BUS).
• Non-automotive grade with PPAP "No", suited for industrial and commercial use.
• Non-RoHS compliant, catering to legacy or specialized applications where lead-free restrictions are not critical.

GS8B011101JCT Applications

This resistor network excels in:

• Voltage divider circuits requiring tight tolerance matching.
• Signal conditioning in instrumentation and sensor interfaces.
• Bus termination for digital communication lines (e.g., SPI, I2C).
• Industrial control systems where thermal resilience and long-term reliability are paramount.
• Legacy electronics repair or designs exempt from RoHS compliance.

Conclusion of GS8B011101JCT

The GS8B011101JCT combines precision, compactness, and ruggedness, making it a standout choice for engineers needing reliable resistor networks in non-automotive, industrial environments. Its ceramic construction, bussed design, and thin-film accuracy address critical needs in signal integrity and power distribution, while the SOIC package ensures compatibility with standard assembly processes. For applications demanding stable performance under thermal cycling and moderate power loads, this model offers a balanced blend of technical sophistication and practical usability.