TT Electronics/IRC

GS8B011102FDT

GS8B011102FDT Description

The GS8B011102FDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Housed in a 16-pin narrow SOIC package, this bussed network integrates 15 thin-film resistors, each with a 11 kΩ resistance and a tight ±1% absolute tolerance. Its ±100 ppm/°C temperature coefficient ensures stable performance across a wide operating temperature range of -70°C to +125°C. The device features gull-wing terminations for reliable surface-mount assembly, with a 0.05W (1/20) power rating per resistor and a total power rating of 0.8W. The SOIC-C series construction offers robust ceramic substrate reliability, making it ideal for environments requiring durability and precision.

GS8B011102FDT Features

• High-Density Integration: 15 resistors in a compact 9.91mm × 5.99mm × 1.45mm SOIC package.
• Precision Performance: ±1% tolerance and ±0.5% ratio tolerance for critical analog/digital signal conditioning.
• Wide Temperature Range: Derated power operation up to 125°C, suitable for industrial and automotive-adjacent applications.
• Thin-Film Technology: Delivers low noise and high stability compared to thick-film alternatives.
• Robust Construction: Ceramic case enhances thermal and mechanical resilience.
• Compliance: EAR99 ECCN (export-friendly), though non-RoHS (restricted material content).

GS8B011102FDT Applications

This resistor network excels in:

• Voltage Divider Networks: Precision attenuation in sensor interfaces or ADC/DAC circuits.
• Bus Termination: Signal integrity in high-speed digital systems (e.g., memory modules, FPGAs).
• Industrial Control Systems: Stable performance in harsh environments (PLC I/O modules, motor drives).
• Test & Measurement Equipment: Calibration circuits requiring low TCR drift.
• Aerospace & Defense: Non-RoHS compliance may suit legacy systems with specific material requirements.

Conclusion of GS8B011102FDT

The GS8B011102FDT stands out for its precision, compactness, and thermal resilience, making it a superior choice over generic thick-film networks. Its ceramic substrate and thin-film technology ensure long-term reliability in critical applications, while the bussed design simplifies PCB layout. Though not PPAP-capable or automotive-qualified, it is ideal for industrial, telecom, and high-reliability electronics where stability under thermal stress is paramount. Engineers should verify RoHS compliance for regulated markets but can leverage its tight tolerances and robust packaging for mission-critical designs.