TT Electronics/IRC

GS8B011150FCT

GS8B011150FCT Description

The GS8B011150FCT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications requiring stable resistance values and robust thermal performance. Packaged in a 16-pin narrow SOIC (SOIC-C Series), this bussed network integrates 15 thin-film resistors, each rated at 115Ω with ±1% absolute tolerance and an exceptional ±0.25% ratio tolerance. The device operates over a wide temperature range of -55°C to +125°C, with a derated power range of 70°C to 125°C, ensuring reliability in demanding environments. Its ±100ppm/°C temperature coefficient and 100V maximum voltage rating make it suitable for precision analog and digital circuits. The 0.05W (1/20) power rating per resistor and 0.8W total power dissipation balance compactness with performance.

GS8B011150FCT Features

• Ceramic substrate for superior thermal stability and durability.
• Thin-film technology ensures low noise and high precision (±1% tolerance, ±0.25% ratio tolerance).
• Bussed configuration simplifies PCB layout for common bus applications.
• Gull-wing termination and 1.27mm terminal pitch for easy surface-mount assembly.
• Compact dimensions: 9.91mm (L) × 5.99mm (D) × 1.45mm (H), with tight tolerances (±0.1mm L/H, ±0.2mm D).
• Non-automotive grade (PPAP: No) but ideal for industrial and telecom applications.
• Non-RoHS compliant (EU RoHS: Not Compliant), suitable for legacy designs.

GS8B011150FCT Applications

This resistor network excels in:

• Voltage dividers and pull-up/pull-down networks in precision analog circuits.
• Signal conditioning for ADCs/DACs and sensor interfaces.
• Bus termination in high-speed digital systems (e.g., SPI, I²C).
• Industrial control systems requiring stable resistance under thermal stress.
• Legacy equipment maintenance where non-RoHS compliance is acceptable.

Conclusion of GS8B011150FCT

The GS8B011150FCT stands out for its ceramic construction, tight tolerances, and bussed design, offering reliability in precision and high-temperature environments. While not suited for automotive or RoHS-mandated designs, its low TCR, high power density, and compact SOIC package make it a top choice for industrial, telecom, and instrumentation applications. Engineers will appreciate its ease of integration and consistent performance across thermal cycles.