TT Electronics/IRC

GS8B011332JGT

GS8B011332JGT Description

The GS8B011332JGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. Packaged in a 16-pin narrow SOIC (SOIC-C) format, this bussed network integrates 15 thin-film resistors, each with a 13.3KΩ resistance and a ±5% absolute tolerance. The device operates over a wide temperature range of -70°C to +125°C, with a derated power capability up to 125°C, ensuring reliability in thermally challenging conditions. Its ±100ppm/°C temperature coefficient and ±2% ratio tolerance make it suitable for applications requiring stable resistance matching. The 0.05W (1/20) power rating per resistor and 100V maximum voltage rating further enhance its versatility.

GS8B011332JGT Features

• Ceramic substrate for superior thermal stability and durability.
• Thin-film technology ensures low noise and high precision.
• Bussed circuit design simplifies PCB layout for bus line applications.
• Gull-wing termination for reliable surface-mount assembly (SMD).
• Compact SOIC package (9.91mm × 5.99mm × 1.45mm) with tight tolerances (±0.1mm height/length).
• 0.8W total power rating and 1.27mm terminal pitch for efficient power distribution.
• Non-automotive (PPAP: No) but ideal for industrial and telecom applications.

GS8B011332JGT Applications

This resistor network excels in:

• Voltage divider circuits requiring matched resistance ratios.
• Signal conditioning in test/measurement equipment.
• Bus termination for digital communication interfaces (e.g., SPI, I²C).
• Industrial control systems where temperature stability is critical.
• Power management modules in telecom infrastructure.

Conclusion of GS8B011332JGT

The GS8B011332JGT stands out for its robust ceramic construction, precision thin-film resistors, and bussed architecture, making it a reliable choice for engineers designing high-stability circuits. While not RoHS-compliant, its wide operating range and tight tolerances cater to specialized industrial and communication applications where performance outweighs compliance constraints. Its SOIC package ensures compatibility with automated assembly processes, reducing manufacturing costs.