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GS8B011370GGT
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GS8B011370GGT Description
GS8B011370GGT Description
The GS8B011370GGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin Narrow SOIC device features 15 bussed resistors with a 137Ω resistance value and a tight ±2% absolute tolerance, ensuring consistent performance in demanding circuits. Built with thin-film technology, it offers excellent stability with a ±100ppm/°C temperature coefficient, making it suitable for environments with operating temperatures ranging from 70°C to 125°C. The SOIC package (9.91mm × 5.99mm × 1.45mm) provides a compact footprint for surface-mount applications, while the gull-wing termination ensures reliable solder joints.
GS8B011370GGT Features
- Ceramic construction for enhanced thermal and mechanical stability.
- 15 bussed resistors (16-pin SOIC) with 137Ω ±2% tolerance and ±2% ratio tolerance.
- Thin-film technology ensures low noise and high precision.
- Wide temperature range: -55°C to +125°C (derated power up to 125°C).
- Power rating: 0.05W per resistor (0.8W total), supporting 100V maximum voltage.
- Gull-wing termination for robust surface-mount assembly.
- Non-automotive, non-PPAP compliant, ideal for industrial and commercial use.
- EU RoHS non-compliant, suitable for legacy or specialized applications.
GS8B011370GGT Applications
This resistor network excels in precision analog and digital circuits, including:
- Voltage dividers and bus termination in communication systems.
- Signal conditioning for sensors and measurement equipment.
- Industrial control systems requiring stable resistance under thermal stress.
- Medical electronics where consistent performance is critical.
- Legacy equipment maintenance due to its non-RoHS compliance.
Conclusion of GS8B011370GGT
The GS8B011370GGT stands out for its ceramic thin-film construction, tight tolerances, and high-temperature resilience, making it a reliable choice for precision electronics. While not suited for automotive or RoHS-regulated applications, its bussed design and SOIC footprint offer a compact, high-performance solution for industrial, medical, and communication systems. Engineers will appreciate its balance of stability, power handling, and space efficiency in complex circuit designs.



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