TT Electronics/IRC

GS8B011401GBT

GS8B011401GBT Description

The GS8B011401GBT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Packaged in a 16-pin narrow SOIC (SOIC-C Series), this bussed network integrates 15 thin-film resistors with a 1.4KΩ resistance value and a tight absolute tolerance of ±2%. Its ±100ppm/°C temperature coefficient ensures stable performance across a wide operating temperature range of 70°C to 125°C, derated for optimal reliability. The device features gull-wing terminations for secure surface-mount (SMD) assembly, with a compact footprint of 9.91mm (L) × 5.99mm (D) × 1.45mm (H) and tight dimensional tolerances. Rated for 100V maximum voltage and 0.8W total power dissipation, it is ideal for space-constrained designs requiring robust thermal and electrical characteristics.

GS8B011401GBT Features

• High-Density Integration: 15 resistors in a 16-pin SOIC package, reducing PCB footprint.
• Precision Thin-Film Technology: Delivers ±2% tolerance and ±0.1% ratio tolerance for matched performance.
• Wide Temperature Range: Operates reliably from 70°C to 125°C with derated power handling.
• Robust Construction: Ceramic case ensures durability and thermal stability.
• Low TCR: ±100ppm/°C minimizes resistance drift under thermal stress.
• Automotive-Grade Alternatives: While not PPAP-certified, its 125°C max temperature suits industrial and telecom applications.
• Surface-Mount Ready: Gull-wing leads with 1.27mm pitch simplify automated assembly.

GS8B011401GBT Applications

This resistor network excels in:

• Voltage Divider Networks: Precision ratio tolerance (±0.1%) ensures accurate signal conditioning.
• Industrial Control Systems: Stable performance in high-temperature environments (e.g., motor drives, PLCs).
• Telecommunications Equipment: Compact size and low TCR suit RF and baseband circuits.
• Test & Measurement Instruments: Tight tolerances enhance calibration accuracy.
• Power Management Circuits: Bussed design simplifies bus termination and pull-up/down networks.

Conclusion of GS8B011401GBT

The GS8B011401GBT combines high precision, thermal resilience, and space efficiency, making it a superior choice for engineers prioritizing reliability in harsh environments. Its ceramic construction, thin-film technology, and bussed architecture offer distinct advantages over polymer-based networks, particularly in applications demanding low drift and matched resistance values. While not RoHS-compliant, its performance metrics cater to specialized industrial and telecom needs where durability and accuracy are critical.