TT Electronics/IRC

GS8B011471GBT

GS8B011471GBT Description

The GS8B011471GBT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 16-pin narrow SOIC package features 15 bussed (BUS) thin-film resistors, each with a 1.47KΩ resistance and a tight ±2% absolute tolerance, ensuring consistent performance. The device operates within a wide temperature range of 70°C to 125°C (derated) and can withstand up to 125°C maximum operating temperature, making it suitable for environments with thermal stress. Its ±100ppm/°C temperature coefficient guarantees stability across varying conditions, while the 0.05W (1/20) power rating per resistor and 0.8W total power rating provide reliable power dissipation.

GS8B011471GBT Features

• Ceramic SOIC-C Series Construction: Ensures durability and thermal stability in harsh conditions.
• Bussed Network Design (15 Resistors): Simplifies circuit layout with shared connections.
• Precision Thin-Film Technology: Delivers low noise and high accuracy (±2% tolerance, ±0.1% ratio tolerance).
• High Voltage Rating (100V): Suitable for industrial and automotive-grade applications.
• Gull Wing Termination: Facilitates easy surface-mount assembly (SMD) with a 1.27mm terminal pitch.
• Compact Dimensions (9.91mm x 5.99mm x 1.45mm): Ideal for space-constrained PCB designs.
• Non-Automotive & Non-PPAP Compliant: Optimized for general industrial use.

GS8B011471GBT Applications

This resistor network excels in:

• Signal Conditioning Circuits: Precision voltage dividers and pull-up/down networks.
• Industrial Control Systems: Stable performance in PLCs, sensors, and instrumentation.
• Power Management Modules: Reliable current limiting and bias networks.
• Test & Measurement Equipment: Low-drift resistance for calibration and reference circuits.
• Telecommunications Hardware: Robust filtering and impedance matching in RF/mixed-signal PCBs.

Conclusion of GS8B011471GBT

The GS8B011471GBT stands out for its ceramic-based reliability, tight tolerances, and thermal resilience, making it a superior choice over plastic-encapsulated networks. While not automotive-grade, its thin-film technology and bussed architecture streamline designs in industrial, telecom, and precision electronics. Engineers will appreciate its balance of performance, compactness, and cost-effectiveness for medium-power applications.