TT Electronics/IRC

GS8B011541FT

GS8B011541FT Description

The GS8B011541FT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Housed in a 16-pin narrow SOIC package, this bussed network integrates 15 thin-film resistors with a 1.54KΩ resistance value and a tight ±1% tolerance. The device operates over a wide temperature range of 70°C to 125°C with a derated power capability, ensuring reliability in thermally challenging environments. Its ±100ppm/°C temperature coefficient guarantees stable performance under varying thermal conditions. The SOIC-C series construction features gull-wing terminations for robust surface-mount (SMD) compatibility, making it ideal for automated assembly processes.

GS8B011541FT Features

• High Precision: Thin-film technology delivers ±1% absolute tolerance and low TCR (±100ppm/°C).
• Robust Construction: Ceramic case ensures durability and thermal stability.
• Optimized Power Handling: 0.8W total power rating (0.05W per resistor) with a 100V maximum voltage rating.
• Compact & Standardized: 9.91mm × 5.99mm × 1.45mm dimensions with ±0.1mm length/height tolerances for consistent PCB integration.
• Bussed Design: Simplifies circuit layout by connecting multiple resistors to a common node (BUS).
• Industrial Compliance: HTS 8533.21.00.20 and ECCN EAR99 classifications facilitate global sourcing.

GS8B011541FT Applications

This resistor network excels in:

• Analog Signal Conditioning: Precision voltage dividers and sensor interfaces in measurement systems.
• Bus Termination: Effective impedance matching in communication buses (e.g., CAN, I2C).
• Power Management: Current-limiting and pull-up/down networks in DC-DC converters or microcontroller circuits.
• Automotive & Industrial Electronics: Suitable for non-automotive PPAP applications requiring stable performance under thermal stress.

Conclusion of GS8B011541FT

The GS8B011541FT combines precision, reliability, and compactness, making it a standout choice for engineers designing high-density PCBs or systems requiring stable resistance networks. Its ceramic substrate, thin-film technology, and bussed architecture offer superior performance over generic arrays, particularly in thermal-critical or space-constrained applications. While not PPAP or automotive-qualified, its industrial-grade robustness and standard SOIC footprint ensure broad compatibility across consumer, telecom, and industrial electronics.