TT Electronics/IRC

GS8B011580DT

GS8B011580DT Description

The GS8B011580DT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding surface-mount applications. This 16-pin narrow SOIC device integrates 15 bussed resistors with a 158Ω resistance value and an exceptional ±0.5% absolute tolerance, ensuring reliable performance in precision circuits. Built with thin-film technology, it offers a ±100ppm/°C temperature coefficient, maintaining stability across a wide operating range of -70°C to +125°C. The SOIC-C series package features a compact 9.91mm × 5.99mm footprint with gull-wing terminations, optimized for automated PCB assembly. With a 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating, it balances power handling with space efficiency.

GS8B011580DT Features

• High Precision: ±0.5% tolerance and ±100ppm/°C TCR for stable performance.
• Robust Construction: Ceramic case ensures durability and thermal stability.
• Space-Saving Design: Narrow SOIC (1.63mm height) suits high-density layouts.
• Bussed Configuration: Simplifies bus line termination and reduces component count.
• Wide Temperature Range: Operates reliably from -70°C to +125°C (derated power).
• Automation-Friendly: 1.27mm terminal pitch and gull-wing leads enable seamless SMT placement.
• Non-Automotive: Ideal for industrial/commercial use (PPAP not required).

GS8B011580DT Applications

This resistor network excels in:

• Voltage Division & Pull-Up/Down Circuits: Precision resistance matching in ADCs/DACs.
• Bus Termination: EMI reduction in digital communication systems (e.g., SPI, I²C).
• Industrial Controls: Stable performance in PLC modules and sensor interfaces.
• Test & Measurement Equipment: High-accuracy signal conditioning.
• Power Management: Load sharing in low-power DC/DC converters.

Conclusion of GS8B011580DT

The GS8B011580DT stands out for its precision, compactness, and reliability, making it a superior choice for high-density, temperature-critical designs. Its ceramic thin-film construction and bussed architecture reduce BOM complexity while ensuring consistent performance. Though non-compliant with EU RoHS, it remains a cost-effective solution for industrial and commercial electronics where exacting resistance values and thermal stability are paramount. Engineers will appreciate its balance of miniaturization, power handling, and tolerance precision in space-constrained applications.