TT Electronics/IRC

GS8B011621JBT

GS8B011621JBT Description

The GS8B011621JBT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 16-pin Narrow SOIC package features 15 bussed resistors with a 1.62KΩ resistance value and a ±5% absolute tolerance, ensuring reliable performance in tightly controlled environments. The thin-film technology provides excellent stability with a ±100ppm/°C temperature coefficient, making it suitable for applications requiring minimal resistance drift. With a power rating of 0.8W (0.05W per resistor) and a maximum operating temperature of 125°C, this network is engineered for durability in industrial and commercial settings.

GS8B011621JBT Features

• Ceramic substrate for superior thermal and mechanical stability.
• Bussed circuit design simplifies PCB layout and reduces component count.
• Gull-wing termination ensures secure surface-mount attachment.
• SOIC package (9.91mm x 5.99mm x 1.45mm) with tight tolerances (±0.1mm height, ±0.2mm depth).
• Wide voltage rating (100V max) and derated power handling up to 125°C.
• Non-automotive (PPAP: No) but ideal for industrial and instrumentation use.
• Non-RoHS compliant, suitable for legacy or specialized applications.

GS8B011621JBT Applications

This resistor network excels in:

• Signal conditioning and voltage division in analog circuits.
• Bus termination for digital communication lines (e.g., SPI, I²C).
• Precision instrumentation where low TCR (±100ppm/°C) is critical.
• Power supply feedback networks due to its stable thin-film construction.
• Embedded systems requiring compact, high-density resistor arrays.

Conclusion of GS8B011621JBT

The GS8B011621JBT stands out for its robust ceramic construction, tight tolerance (±5%), and high-temperature resilience, making it a reliable choice for engineers prioritizing precision and longevity. While not suited for automotive use, its bussed design and SOIC footprint streamline integration in industrial PCBs, reducing assembly complexity. For applications demanding stable resistance under thermal stress, this network delivers consistent performance where generic alternatives may falter.