TT Electronics/IRC

GS8B011742GGT

GS8B011742GGT Description

The GS8B011742GGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 17.4KΩ resistance value, offering an absolute tolerance of ±2% and a ratio tolerance of ±2%. Built with thin-film technology, it ensures stable performance across a wide temperature range of -55°C to +125°C, with a temperature coefficient of ±100ppm/°C. The SOIC-C series package provides robust mechanical stability, with dimensions of 9.91mm (L) x 5.99mm (D) x 1.45mm (H) and tight tolerances (±0.1mm for length/height, ±0.2mm for depth). Rated for 100V maximum voltage and 0.8W total power dissipation, it is ideal for surface-mount applications requiring reliability in harsh environments.

GS8B011742GGT Features

• Ceramic case for superior thermal and mechanical durability.
• Thin-film technology ensures low noise and high precision (±2% tolerance).
• Bussed network design simplifies circuit layout for bus termination or pull-up/down applications.
• Wide operating temperature (-55°C to +125°C) with derated power up to 125°C.
• Gull-wing termination for reliable surface-mount soldering.
• Compact SOIC package (9.91mm x 5.99mm) with tight dimensional tolerances.
• 100V maximum voltage rating and 0.05W per resistor power handling.

GS8B011742GGT Applications

• Bus termination networks in high-speed digital systems (e.g., DDR memory interfaces).
• Voltage divider circuits in precision analog designs.
• Pull-up/pull-down resistor arrays for microcontrollers and FPGAs.
• Industrial control systems requiring stable performance under thermal stress.
• Automotive electronics (non-automotive qualified; suitable for prototyping).

Conclusion of GS8B011742GGT

The GS8B011742GGT excels in precision, durability, and space efficiency, making it a top choice for high-reliability electronics. Its ceramic construction, thin-film resistors, and bussed architecture provide distinct advantages over polymer-based networks, particularly in thermal stability and signal integrity. While not PPAP or automotive-qualified, it is ideal for industrial, telecom, and computing applications demanding tight tolerances and robust performance. Engineers will appreciate its ease of integration and consistent performance across varying environmental conditions.