TT Electronics/IRC

GS8B011801CBT

GS8B011801CBT Description

The GS8B011801CBT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 16-pin narrow SOIC package, this bussed (BUS) configuration integrates 15 thin-film resistors, each with a 1.8KΩ resistance and an exceptional ±0.25% absolute tolerance (±0.1% ratio tolerance). The device operates over a wide temperature range of -70°C to +125°C, with a ±100ppm/°C temperature coefficient, ensuring stability in fluctuating environments. Its 0.05W (1/20) power rating per resistor and 0.8W total power rating make it suitable for low-power circuits, while the 100V maximum voltage rating adds robustness. The SOIC-C series construction features a rectangular ceramic case with gull-wing terminations, optimized for surface-mount (SMD) assembly.

GS8B011801CBT Features

• Precision Performance: ±0.25% tolerance and ±100ppm/°C TCR for high-accuracy signal conditioning.
• Robust Construction: Ceramic substrate ensures thermal stability and durability.
• Space-Efficient: Compact 9.91mm × 5.99mm × 1.45mm footprint with 1.27mm terminal pitch.
• Bussed Design: Simplified PCB layout with shared common connections.
• Wide Operating Range: Reliable performance from -70°C to +125°C (derated power).
• Thin-Film Technology: Low noise and excellent long-term stability.
• Non-Automotive: Ideal for industrial, telecom, and instrumentation applications.

GS8B011801CBT Applications

This resistor network excels in:

• Precision voltage dividers and reference circuits in test equipment.
• Signal conditioning for ADCs/DACs in data acquisition systems.
• Impedance matching in RF and communication devices.
• Feedback networks for op-amps and analog control systems.
• Medical electronics where stability and accuracy are critical.

Conclusion of GS8B011801CBT

The GS8B011801CBT combines precision, compactness, and reliability, making it a standout choice for engineers designing high-accuracy analog circuits. Its ceramic thin-film construction and tight tolerances cater to applications demanding minimal drift and consistent performance. While not PPAP or automotive-qualified, it is well-suited for industrial, medical, and telecom systems where component integrity is paramount. The SOIC package ensures compatibility with automated assembly, further enhancing its appeal for volume production.