TT Electronics/IRC

GS8B011821FBT

GS8B011821FBT Description

The GS8B011821FBT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 1.82KΩ resistance value and a tight ±1% absolute tolerance, ensuring consistent performance. Built with thin-film technology, it offers excellent stability with a ±100ppm/°C temperature coefficient, making it suitable for environments with fluctuating temperatures. The SOIC package (9.91mm × 5.99mm × 1.45mm) is optimized for surface-mount assembly, with gull-wing terminations for reliable PCB connections. Rated for 100V maximum voltage and 0.8W total power dissipation, it operates reliably within a 70°C to 125°C derated power range.

GS8B011821FBT Features

• Bussed Network Design: Simplifies circuit layout with 15 interconnected resistors.
• High Precision: ±1% tolerance and ±0.1% ratio tolerance for critical analog/digital systems.
• Robust Construction: Ceramic substrate ensures durability and thermal stability.
• Wide Operating Range: Functions from -55°C to +125°C, derated to 70°C–125°C for power.
• Surface-Mount Ready: 1.27mm terminal pitch and SOIC footprint for easy PCB integration.
• Low TCR: ±100ppm/°C minimizes resistance drift under thermal stress.
• Non-Automotive: Ideal for industrial, telecom, and instrumentation applications.

GS8B011821FBT Applications

This resistor network excels in:

• Voltage Divider Circuits: Precision attenuation in sensor interfaces.
• Signal Conditioning: Stable termination for ADCs/DACs in data acquisition systems.
• Industrial Controls: Reliable performance in PLCs and power management modules.
• Telecom Hardware: Impedance matching and filtering in RF/analog boards.
• Test & Measurement Equipment: Low-drift reference networks for calibration.

Conclusion of GS8B011821FBT

The GS8B011821FBT stands out for its precision, compact SOIC package, and thin-film reliability, making it a superior choice over thicker-film networks. Its bussed architecture reduces component count, while ceramic construction ensures longevity in harsh environments. Though not RoHS-compliant or automotive-grade, it is ideal for industrial and telecom systems demanding tight tolerances and thermal resilience. Engineers will appreciate its balance of performance, size, and cost for high-density PCB designs.