TT Electronics/IRC

GS8B011871FDT

GS8B011871FDT Description

The GS8B011871FDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Housed in a 16-pin narrow SOIC package, this bussed network integrates 15 thin-film resistors, each with a resistance value of 1.87KΩ and a tight ±1% absolute tolerance. The device operates over a wide temperature range of -55°C to +125°C, with a derated power range of 70°C to 125°C, ensuring reliability in thermally challenging environments. Its ±100ppm/°C temperature coefficient and 0.05W (1/20) power rating per resistor make it suitable for stable, low-power signal conditioning.

GS8B011871FDT Features

• Ceramic SOIC-C Series Construction: Offers superior thermal stability and mechanical robustness compared to polymer-based networks.
• Bussed Network Design: Simplifies PCB layout by reducing discrete component count, ideal for bus termination and voltage division.
• High Precision: ±1% absolute tolerance and ±0.5% ratio tolerance ensure consistent performance in matched resistor applications.
• Thin-Film Technology: Delivers low noise and excellent long-term stability.
• Surface-Mount Gull Wing Termination: Facilitates automated assembly with a 1.27mm terminal pitch.
• Compact Dimensions: 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• 100V Maximum Voltage Rating: Suitable for industrial and instrumentation circuits.

GS8B011871FDT Applications

This resistor network excels in:

• Analog Signal Processing: Precision dividers, DAC/ADC reference networks.
• Bus Termination: For CAN, I2C, or SPI interfaces in automotive (non-AECQ) and industrial systems.
• Voltage Scaling: Sensor signal conditioning in test/measurement equipment.
• Embedded Systems: Space-constrained designs requiring reliable, high-density passive integration.

Conclusion of GS8B011871FDT

The GS8B011871FDT combines ceramic durability, thin-film precision, and compact SOIC packaging to address critical needs in modern electronics. Its bussed architecture reduces board complexity, while its ±100ppm/°C stability ensures performance across temperature extremes. Though not PPAP or automotive-qualified, it is a cost-effective solution for industrial, telecom, and instrumentation applications demanding high accuracy and repeatability. Engineers will appreciate its balance of size, performance, and reliability in dense circuit designs.