TT Electronics/IRC

GS8B011962FAT

GS8B011962FAT Description

The GS8B011962FAT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Housed in a 16-pin narrow SOIC package, it features 15 bussed resistors with a 19.6KΩ resistance value and a tight ±1% absolute tolerance, ensuring consistent performance. The thin-film technology and ±100ppm/°C temperature coefficient provide excellent stability across a wide operating temperature range of -70°C to +125°C. With a 0.05W (1/20) power rating per resistor and a total power rating of 0.8W, this network is optimized for low-power, high-reliability circuits. The gull-wing termination and surface-mount design facilitate easy PCB integration, while the ceramic case ensures durability in demanding environments.

GS8B011962FAT Features

• Precision Resistance: 19.6KΩ ±1% tolerance with ±0.05% ratio tolerance for matched performance.
• Robust Construction: Ceramic SOIC package (9.91mm x 5.99mm x 1.45mm) with ±0.1mm height/length tolerances.
• Thermal Stability: ±100ppm/°C TCR and 125°C max operating temperature ensure reliability under thermal stress.
• High Voltage Handling: Supports up to 100V maximum voltage rating.
• Optimized Layout: Bussed (BUS) circuit design simplifies routing in multi-resistor applications.
• Industry Compliance: EAR99 ECCN (export-friendly), though non-RoHS (restricted for certain regions).

GS8B011962FAT Applications

This resistor network excels in:

• Analog Signal Conditioning: Precision voltage dividers and sensor interfaces in industrial controls.
• Medical Electronics: Stable reference circuits in diagnostic equipment.
• Automotive Systems (non-Automotive PPAP): Engine control units (ECUs) where thermal resilience is critical.
• Aerospace & Defense: Avionics and communication systems requiring low drift and high durability.
• Test & Measurement Equipment: Calibration circuits demanding matched resistance ratios.

Conclusion of GS8B011962FAT

The GS8B011962FAT stands out for its precision, thermal performance, and compact SOIC footprint, making it ideal for high-reliability electronics. While not PPAP-capable or RoHS-compliant, its ceramic construction and thin-film technology offer superior stability over plastic-encased alternatives. Engineers will value its bussed design for simplified PCB layouts and tight tolerances for critical analog applications. A top choice for industrial, medical, and aerospace designs where accuracy and endurance are paramount.