TT Electronics/IRC

GS8B011962JFT

GS8B011962JFT Description

The GS8B011962JFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. Housed in a 16-pin narrow SOIC package, this bussed network integrates 15 thin-film resistors with a common resistance value of 19.6KΩ and a ±5% absolute tolerance. The device operates over a wide temperature range of -70°C to +125°C, ensuring reliability in harsh conditions. With a ±100ppm/°C temperature coefficient and a 1% ratio tolerance, it delivers exceptional stability and accuracy. The SOIC-C series construction features a rectangular ceramic substrate, gull-wing terminations, and a compact footprint (9.91mm x 5.99mm x 1.45mm), making it ideal for space-constrained designs. Rated for 100V maximum voltage and 0.8W total power dissipation, it balances performance with durability.

GS8B011962JFT Features

• Bussed Circuit Design: Simplifies PCB layout by connecting multiple resistors to a common node.
• High Power Handling: 0.05W per resistor (0.8W total) with derating up to 125°C.
• Stable Thin-Film Technology: Delivers ±100ppm/°C TCR for minimal resistance drift.
• Robust Construction: Ceramic case ensures thermal and mechanical resilience.
• Precision Tolerance: ±5% absolute and ±1% ratio tolerance for matched performance.
• Surface-Mount Compatibility: Gull-wing leads with 1.27mm pitch for easy assembly.
• Non-Automotive Grade: Suitable for industrial, telecom, and instrumentation applications.

GS8B011962JFT Applications

• Voltage Divider Networks: Precision signal conditioning in measurement equipment.
• Bus Termination: Impedance matching in high-speed digital circuits (e.g., memory modules).
• Analog Signal Processing: Stable gain-setting networks in op-amp circuits.
• Industrial Controls: Reliable operation in PLCs and motor drives.
• Telecom Infrastructure: Dense PCB designs requiring compact, high-tolerance arrays.

Conclusion of GS8B011962JFT

The GS8B011962JFT stands out for its ceramic-based durability, tight tolerance matching, and bussed topology, making it a superior choice for applications demanding thermal stability and space efficiency. While not PPAP or automotive-qualified, its industrial-grade robustness and thin-film precision cater to high-reliability sectors like telecom, test equipment, and power management. Engineers will appreciate its balance of performance and ease of integration, particularly in designs where consistent resistance ratios and compact form factors are critical.