TT Electronics/IRC

GS8B012002FBT

GS8B012002FBT Description

The GS8B012002FBT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Housed in a 16-pin narrow SOIC package, this bussed network integrates 15 thin-film resistors, each with a 20KΩ resistance and an absolute tolerance of ±1%. The device operates over a wide temperature range (70°C to 125°C) with a ±100ppm/°C temperature coefficient, ensuring stable performance under thermal stress. Its 0.05W (1/20) power rating per resistor and 100V maximum voltage rating make it suitable for low-power, high-voltage environments. The SOIC-C series construction features a rectangular ceramic case, gull-wing termination, and surface-mount compatibility, offering robust mechanical and electrical reliability.

GS8B012002FBT Features

• Precision Network: 15 bussed resistors with ±1% tolerance and ±0.1% ratio tolerance for matched performance.
• High-Temperature Stability: ±100ppm/°C TCR ensures minimal drift across -70°C to +125°C.
• Robust Construction: Ceramic substrate and thin-film technology enhance durability and thermal dissipation.
• Compact & Reliable: 9.91mm x 5.99mm footprint with 1.45mm height, ideal for space-constrained PCBs.
• Surface-Mount Ready: Gull-wing leads and 1.27mm pitch simplify automated assembly.
• Wide Voltage Range: Supports up to 100V, suitable for industrial and automotive (non-PPAP) applications.

GS8B012002FBT Applications

• Signal Conditioning: Precision voltage dividers in sensor interfaces and ADC circuits.
• Industrial Controls: Feedback networks in power supplies and motor drivers.
• Test & Measurement Equipment: Calibration resistors for high-accuracy instrumentation.
• Telecom Infrastructure: Impedance matching in RF and baseband systems.
• Medical Electronics: Low-noise analog circuits where stability is critical.

Conclusion of GS8B012002FBT

The GS8B012002FBT stands out for its ceramic-based reliability, tight tolerance, and thermal resilience, making it a superior choice over plastic-encapsulated networks. While not PPAP-certified for automotive use, its thin-film precision and compact SOIC package cater to industrial, medical, and telecom applications requiring long-term stability. Engineers will appreciate its balance of performance, size, and cost in high-reliability designs.