TT Electronics/IRC

GS8B012262GAT

GS8B012262GAT Description

The GS8B012262GAT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Housed in a 16-pin narrow SOIC package, it features 15 bussed resistors with a 22.6KΩ resistance value and a tight ±2% absolute tolerance. The device operates over a wide temperature range (70°C to 125°C) with a ±100ppm/°C temperature coefficient, ensuring stability in demanding environments. Its thin-film technology and 0.05W (1/20) power rating per resistor (0.8W total) make it suitable for low-power, high-density circuits. The SOIC-C series construction offers robust mechanical and thermal performance, with a compact footprint (9.91mm × 5.99mm × 1.45mm) and gull-wing termination for reliable surface-mount assembly.

GS8B012262GAT Features

• Bussed Network Design: 15 resistors connected in a single bus configuration, simplifying circuit layout.
• High Precision: ±2% absolute tolerance and ±0.05% ratio tolerance for critical analog/digital applications.
• Wide Operating Range: Rated for 125°C maximum temperature and 100V maximum voltage.
• Stable Performance: ±100ppm/°C TCR ensures minimal resistance drift.
• Robust Construction: Ceramic substrate and SOIC package provide excellent thermal dissipation and mechanical durability.
• Surface-Mount Ready: 1.27mm terminal pitch and gull-wing leads enable easy PCB integration.

GS8B012262GAT Applications

• Voltage Divider Networks: Ideal for precision analog signal conditioning.
• Bus Termination: Ensures signal integrity in high-speed digital systems (e.g., memory modules, FPGAs).
• Sensor Interfaces: Stable performance for RTD or thermocouple amplification circuits.
• Industrial Electronics: Suitable for harsh environments due to its wide temperature range and ceramic construction.
• Automotive (Non-Automotive Rated): Auxiliary systems where high reliability is required (note: not PPAP/automotive certified).

Conclusion of GS8B012262GAT

The GS8B012262GAT excels in applications demanding precision, stability, and compactness. Its thin-film technology, bussed design, and ceramic package offer superior performance compared to standard thick-film networks. While not RoHS-compliant or automotive-rated, it is a cost-effective solution for industrial, telecom, and instrumentation designs requiring tight tolerances and thermal resilience. Engineers will appreciate its ease of integration and consistent performance across varying operational conditions.