TT Electronics/IRC

GS8B012612GT

GS8B012612GT Description

The GS8B012612GT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Packaged in a 16-pin narrow SOIC (SOIC-C series), this bussed resistor array integrates 15 thin-film resistors with a 26.1KΩ resistance value and a tight ±2% absolute tolerance. Its ±100ppm/°C temperature coefficient ensures stable performance across a wide operating temperature range of -70°C to +125°C, making it suitable for environments with thermal fluctuations. The 0.05W (1/20) power rating per resistor and 0.8W total power rating provide reliable power dissipation, while the 100V maximum voltage rating ensures robustness in high-voltage applications.

GS8B012612GT Features

• Ceramic Case & Thin Film Technology: Enhances thermal stability and durability, ideal for harsh conditions.
• Bussed Network (BUS Designator): Simplifies circuit design by connecting multiple resistors in a single package.
• Precision Tolerance: ±2% resistance tolerance and ±100ppm/°C TCR for consistent performance.
• Compact SOIC Package: 9.91mm length, 5.99mm depth, and 1.45mm height with gull-wing termination for easy surface mounting.
• Wide Temperature Range: Operates reliably from -70°C to +125°C with derated power up to 125°C.
• Non-Automotive, Non-PPAP: Suitable for industrial and commercial applications where PPAP compliance is not required.

GS8B012612GT Applications

• Signal Conditioning Circuits: Precision voltage dividers and pull-up/pull-down networks.
• Industrial Control Systems: Robust performance in PLCs, motor drives, and instrumentation.
• Telecommunications Equipment: Stable resistance in RF and analog signal processing.
• Test & Measurement Devices: High accuracy in calibration and sensor interfaces.
• Power Management Modules: Reliable operation in DC-DC converters and voltage regulators.

Conclusion of GS8B012612GT

The GS8B012612GT stands out for its ceramic construction, thin-film precision, and compact SOIC footprint, offering superior thermal and electrical stability. Its bussed design reduces component count, streamlining PCB layouts, while the wide temperature range ensures versatility across industrial and commercial applications. Though not RoHS-compliant or automotive-grade, it excels in environments demanding high reliability, tight tolerances, and space efficiency. Engineers will appreciate its balance of performance and practicality in precision analog and mixed-signal designs.