
TT Electronics/IRC
GS8B012612JDT
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GS8B012612JDT Description
GS8B012612JDT Description
The GS8B012612JDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Housed in a 16-pin narrow SOIC package, it features 15 bussed resistors with a 26.1KΩ resistance value, ±5% absolute tolerance, and ±0.5% ratio tolerance. Built with thin-film technology, it offers excellent stability with a ±100ppm/°C temperature coefficient. The device operates over a wide temperature range (70°C to 125°C) and delivers a 0.05W (1/20) power rating per resistor, with a total power rating of 0.8W. Its 100V maximum voltage rating and surface-mount gull-wing termination make it suitable for compact, high-density PCB designs.
GS8B012612JDT Features
- Ceramic case for enhanced thermal and mechanical stability.
- Bussed network topology simplifies circuit design in multi-resistor applications.
- Low TCR (±100ppm/°C) ensures consistent performance across temperature variations.
- SOIC package (9.91mm × 5.99mm × 1.45mm) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
- Non-automotive (PPAP: No) but ideal for industrial and instrumentation use.
- Non-RoHS compliant, suitable for legacy or specialized applications.
GS8B012612JDT Applications
This resistor network excels in:
- Signal conditioning circuits requiring precise voltage division.
- Analog and mixed-signal systems where ratio tolerance (±0.5%) is critical.
- Industrial control modules needing robust, temperature-stable components.
- Test and measurement equipment demanding low drift and high accuracy.
- Power management circuits leveraging its 100V rating and 0.8W total dissipation.
Conclusion of GS8B012612JDT
The GS8B012612JDT stands out for its ceramic construction, tight tolerances, and bussed design, making it a reliable choice for precision electronics. While not suited for automotive use, its thin-film technology and stable performance under varying conditions make it ideal for industrial, instrumentation, and high-voltage applications. Its compact SOIC footprint further enhances its appeal for space-constrained designs.



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