TT Electronics/IRC

GS8B012702FT

GS8B012702FT Description

The GS8B012702FT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 27KΩ resistance value and a tight ±1% tolerance, ensuring reliable signal integrity in demanding circuits. Built with thin-film technology, it offers excellent stability with a ±100ppm/°C temperature coefficient, making it suitable for environments with fluctuating thermal conditions. The SOIC package (9.91mm x 5.99mm x 1.45mm) provides a compact footprint, while the gull-wing termination ensures secure surface mounting. Rated for 100V maximum voltage and 0.05W power dissipation per resistor, it operates reliably across a 70°C to 125°C derated power range, with a 125°C maximum operating temperature.

GS8B012702FT Features

• Bussed Network Design: Simplifies PCB layout by connecting multiple resistors in a single package.
• High Precision: ±1% tolerance and ±100ppm/°C TCR ensure consistent performance.
• Robust Construction: Ceramic case enhances durability and thermal management.
• Space-Efficient: SOIC package (9.91mm x 5.99mm) ideal for high-density designs.
• Wide Voltage Range: Supports up to 100V, suitable for industrial and automotive applications.
• Surface-Mount Ready: Gull-wing terminals facilitate automated assembly.

GS8B012702FT Applications

This resistor network excels in:

• Voltage Division Circuits: Precision dividers in sensor interfaces or ADCs.
• Bus Termination: Stabilizes signal lines in communication systems (e.g., CAN, I2C).
• Industrial Controls: Reliable performance in PLCs, motor drives, and power supplies.
• Test & Measurement Equipment: Low-drift resistance for calibration and signal conditioning.
• Aerospace & Defense: Ceramic construction meets rugged environmental demands.

Conclusion of GS8B012702FT

The GS8B012702FT combines precision, compactness, and ruggedness, making it a standout choice for engineers needing stable resistor networks in space-constrained or thermally challenging designs. Its bussed architecture, thin-film technology, and SOIC packaging offer a balanced solution for industrial, automotive, and high-reliability applications where accuracy and durability are critical. While not PPAP or RoHS compliant, its performance metrics justify its use in specialized sectors.