TT Electronics/IRC

GS8B012740JFT

GS8B012740JFT Description

The GS8B012740JFT from TT Electronics/IRC is a high-reliability ceramic resistor network designed for precision applications in demanding environments. This 16-pin narrow SOIC package integrates 15 bussed resistors with a 274Ω resistance value, offering a 5% absolute tolerance and ±1% ratio tolerance for consistent performance. Built with thin-film technology, it ensures low noise and stable operation across a wide temperature range (70°C to 125°C). The device features a 0.8W total power rating (0.05W per resistor) and supports 100V maximum voltage, making it suitable for industrial and automotive-grade circuits. Its gull-wing termination and surface-mount design facilitate easy PCB integration.

GS8B012740JFT Features

• Ceramic Construction: Enhances thermal stability and durability in harsh conditions.
• Bussed Network: Simplifies circuit design with shared connections for streamlined layouts.
• Precision Tolerance: ±5% absolute and ±1% ratio tolerance ensure signal integrity.
• Wide Operating Range: Functions reliably from -55°C to +125°C (derated power above 70°C).
• Low TCR: ±100ppm/°C temperature coefficient minimizes resistance drift.
• Compact SOIC Package: 9.91mm × 5.99mm × 1.45mm dimensions save board space.
• RoHS Non-Compliant: Suitable for legacy systems requiring leaded components.

GS8B012740JFT Applications

• Voltage Division: Ideal for precision dividers in sensor interfaces or ADC circuits.
• Bus Termination: Effective in CAN/LIN bus networks for impedance matching.
• Industrial Controls: Robust performance in PLCs, motor drives, and power supplies.
• Test & Measurement: Stable resistance for calibration and reference circuits.
• Aerospace & Defense: Reliable operation in high-vibration environments.

Conclusion of GS8B012740JFT

The GS8B012740JFT excels in applications demanding high density, precision, and thermal resilience. Its ceramic substrate, thin-film technology, and tight tolerances make it superior to standard epoxy-based networks, particularly in high-temperature or mission-critical systems. While not PPAP or automotive-qualified, its performance aligns with industrial and aerospace requirements. Engineers will value its space-saving SOIC footprint and bussed architecture for reducing component count without compromising reliability.