TT Electronics/IRC

GS8B012800CCT

GS8B012800CCT Description

The GS8B012800CCT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 16-pin narrow SOIC package, this bussed network integrates 15 thin-film resistors, each with a 280Ω resistance and an exceptional ±0.25% absolute tolerance. The device operates over a wide temperature range of -70°C to +125°C, with a ±100ppm/°C temperature coefficient, ensuring stability in fluctuating environments. Its 0.05W (1/20) power rating per resistor and 0.8W total power rating make it suitable for low-power circuits, while the 100V maximum voltage rating adds versatility. The SOIC-C series construction features a rectangular ceramic case, gull-wing termination, and surface-mount compatibility, ideal for automated assembly.

GS8B012800CCT Features

• Precision Performance: ±0.25% tolerance and ±0.25% ratio tolerance for critical analog/digital signal conditioning.
• Robust Construction: Ceramic substrate enhances thermal stability and durability.
• Space-Efficient Design: Compact 9.91mm × 5.99mm × 1.45mm footprint with 1.27mm terminal pitch.
• Wide Operating Range: Derated power up to 125°C, suitable for industrial and automotive environments (non-PPAP).
• Low TCR: ±100ppm/°C ensures minimal resistance drift.
• Bussed Configuration: Simplifies PCB layout for common bus applications.

GS8B012800CCT Applications

This resistor network excels in:

• Voltage Division & Signal Conditioning: Precision dividers in ADCs/DACs.
• Industrial Control Systems: Stable performance in PLCs and sensor interfaces.
• Medical Electronics: Low-noise, high-reliability circuits.
• Telecom Infrastructure: Impedance matching and termination networks.
• Test & Measurement Equipment: Calibration and reference circuits requiring tight tolerances.

Conclusion of GS8B012800CCT

The GS8B012800CCT combines precision, compactness, and thermal resilience, making it a standout choice for engineers prioritizing accuracy and reliability. Its ceramic thin-film technology and bussed architecture reduce design complexity, while the SOIC package ensures compatibility with high-density PCBs. Though non-compliant with EU RoHS, its performance in harsh conditions and critical applications justifies its use in specialized industrial and embedded systems.