TT Electronics/IRC

GS8B013000JCT

GS8B013000JCT Description

The GS8B013000JCT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. Housed in a 16-pin narrow SOIC package, this bussed network integrates 15 thin-film resistors with a 300Ω resistance value and a ±5% absolute tolerance. Its ±100ppm/°C temperature coefficient ensures stable performance across a wide operating temperature range of -70°C to +125°C. The device features gull-wing terminations for reliable surface-mount assembly and offers a power rating of 0.8W (0.05W per resistor). With a 100V maximum voltage rating, it is engineered for robustness in industrial and communication systems.

GS8B013000JCT Features

• Ceramic substrate for superior thermal stability and durability.
• Thin-film technology delivers high precision (±5% tolerance, ±0.25% ratio tolerance).
• Bussed (BUS) configuration simplifies circuit design for common-node applications.
• Wide temperature range (-70°C to +125°C derated) ensures reliability in harsh conditions.
• Compact SOIC package (9.91mm × 5.99mm × 1.45mm) saves board space.
• Gull-wing terminals enhance solder joint integrity for SMT processes.
• Non-automotive grade (PPAP: No), ideal for industrial and telecom use.

GS8B013000JCT Applications

This resistor network excels in:

• Voltage divider circuits requiring tight ratio tolerance (±0.25%).
• Signal conditioning in data acquisition systems.
• Bus termination for high-speed digital interfaces (e.g., SPI, I²C).
• Power supply feedback networks where stability is critical.
• Industrial control systems needing robust, temperature-resistant components.

Conclusion of GS8B013000JCT

The GS8B013000JCT stands out for its ceramic construction, precision thin-film resistors, and bussed architecture, making it a reliable choice for engineers designing compact, high-stability circuits. While not RoHS-compliant, its wide temperature range and low TCR (±100ppm/°C) cater to specialized industrial and communication applications where performance outweighs regulatory constraints. Its SOIC footprint ensures compatibility with standard assembly processes, offering a balance of space efficiency and electrical reliability.