TT Electronics/IRC

GS8B013002JCT

GS8B013002JCT Description

The GS8B013002JCT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Packaged in a 16-pin narrow SOIC (SOIC-C series), it integrates 15 bussed resistors with a 30KΩ resistance value and a ±5% absolute tolerance, ensuring reliable signal integrity. Built with thin-film technology, it offers a low ±100ppm/°C temperature coefficient, making it stable across a wide operating range of 70°C to 125°C. With a 0.05W (1/20) power rating per resistor and a total power rating of 0.8W, this network is engineered for efficiency in compact designs. Its 100V maximum voltage rating and gull-wing termination facilitate robust surface-mount assembly in demanding environments.

GS8B013002JCT Features

• Ceramic substrate for enhanced thermal stability and durability.
• Bussed circuit design simplifies routing in multi-resistor applications.
• ±0.25% ratio tolerance ensures precise matching for differential circuits.
• 1.27mm terminal pitch and 9.91mm x 5.99mm footprint optimize PCB space utilization.
• Non-compliant with EU RoHS, suitable for legacy or specialized industrial systems.
• Thin-film construction delivers superior accuracy and long-term reliability compared to thick-film alternatives.

GS8B013002JCT Applications

Ideal for analog signal conditioning, voltage division, and bus termination in:

• Industrial control systems requiring stable resistance under thermal stress.
• Medical instrumentation where precision and low drift are critical.
• Telecommunications hardware (e.g., line drivers, impedance matching).
• Automotive test equipment (though not PPAP/AEC-Q200 qualified).
• Legacy electronics needing high-voltage tolerance (up to 100V).

Conclusion of GS8B013002JCT

The GS8B013002JCT stands out for its ceramic-based thermal performance, tight tolerance matching, and compact SOIC packaging. While not RoHS-compliant, it excels in high-reliability, non-automotive applications demanding precision and durability. Its bussed architecture reduces component count, streamlining designs in dense PCBs. Engineers will value its balance of power handling, stability, and space efficiency in critical circuits.