TT Electronics/IRC

GS8B013091FDT

GS8B013091FDT Description

The GS8B013091FDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Packaged in a 16-pin narrow SOIC (SOIC-C series), it features 15 bussed resistors with a 3.09KΩ resistance value and a tight ±1% absolute tolerance. The thin-film technology ensures excellent stability with a ±100ppm/°C temperature coefficient, making it suitable for environments with fluctuating thermal conditions. Rated for 0.05W (1/20W) per resistor and 0.8W total power dissipation, it operates reliably within a temperature range of 70°C to 125°C and withstands voltages up to 100V. Its gull-wing termination and surface-mount design facilitate easy PCB integration.

GS8B013091FDT Features

• Ceramic case for enhanced durability and thermal performance.
• Bussed network topology simplifies circuit design in multi-resistor applications.
• 1% absolute tolerance and ±0.5% ratio tolerance for precision signal conditioning.
• Thin-film technology ensures low noise and high stability.
• SOIC package (9.91mm × 5.99mm × 1.45mm) with ±0.1mm length/height tolerances for consistent mounting.
• Wide operating temperature range (-55°C to +125°C) with derated power up to 125°C.
• Non-automotive grade, ideal for industrial and commercial electronics.

GS8B013091FDT Applications

This resistor network excels in:

• Voltage dividers and pull-up/pull-down circuits in analog/digital systems.
• Sensor signal conditioning where precision and thermal stability are critical.
• Embedded systems and communication devices requiring compact, high-density resistor arrays.
• Test and measurement equipment demanding low drift and repeatable performance.
• Power management circuits due to its robust 100V rating and derated power handling.

Conclusion of GS8B013091FDT

The GS8B013091FDT stands out for its ceramic construction, precision tolerances, and thin-film reliability, making it a superior choice for demanding electronic designs. While not PPAP or automotive-qualified, its thermal resilience and compact SOIC footprint cater to industrial, telecom, and instrumentation applications. Engineers will appreciate its balance of performance, size, and cost in space-constrained, high-accuracy circuits.