TT Electronics/IRC_GS8B013240FDT
original

TT Electronics/IRC
GS8B013240FDT

50-GS8B013240FDT
PDF Datasheet
Ceramic Resistor Network, SOIC-C Series,16-Pin Narrow SOIC, Bussed elements,±100ppm/°C, 324Ohm, absolute tolerance ±1%, ratio tolerance ±0.5%
30 weeks

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Tech Specifications

Circuit Designator
BUS
Number of Resistors
15
HTS
8533.21.00.20
Case Style
Ceramic
ECCN (US)
EAR99
Temperature Range @ Derated Power (°C)
70 to 125
PPAP
No
Automotive
No
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GS8B013240FDT Description

GS8B013240FDT Description

The GS8B013240FDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. Housed in a 16-pin narrow SOIC package, this bussed array integrates 15 thin-film resistors with a 324Ω resistance value and a tight ±1% absolute tolerance. Its ±100ppm/°C temperature coefficient ensures stable performance across a wide operating temperature range of -70°C to +125°C. The SOIC-C series construction offers 0.05W (1/20) power rating per resistor and a total power rating of 0.8W, making it suitable for compact, high-density PCB designs. With a 100V maximum voltage rating and gull-wing termination, it combines reliability with ease of surface-mount assembly.

GS8B013240FDT Features

  • Ceramic case for enhanced thermal stability and durability.
  • Thin-film technology delivers precision and low noise.
  • Bussed network simplifies circuit design with shared connections.
  • 1.27mm terminal pitch and 1.45mm profile enable space-efficient layouts.
  • ±0.5% ratio tolerance ensures consistent performance in matched resistor applications.
  • Non-automotive and non-PPAP compliant, ideal for industrial and telecom uses.
  • Tube packaging for secure handling and storage.

GS8B013240FDT Applications

This resistor network excels in:

  • Voltage dividers and pull-up/pull-down circuits in precision analog systems.
  • Signal conditioning for sensors and data acquisition modules.
  • Embedded systems requiring compact, high-reliability passive networks.
  • Telecommunications equipment where stable resistance under thermal stress is critical.
  • Test and measurement instruments demanding low drift and high accuracy.

Conclusion of GS8B013240FDT

The GS8B013240FDT stands out for its ceramic-based robustness, thin-film precision, and space-saving SOIC footprint. While not RoHS-compliant, its wide temperature range and low TCR make it a top choice for industrial and telecom designs. Its bussed architecture reduces component count, streamlining PCB layouts without sacrificing performance. For engineers seeking a reliable, high-density resistor network, this model offers an optimal balance of accuracy, power handling, and thermal resilience.

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