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GS8B013322FDT
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GS8B013322FDT Description
GS8B013322FDT Description
The GS8B013322FDT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding surface-mount applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 33.2KΩ resistance value and an absolute tolerance of ±1%, ensuring consistent performance in precision circuits. Built with thin-film technology, it offers a ±100ppm/°C temperature coefficient, making it suitable for environments with fluctuating thermal conditions. The SOIC package (9.91mm x 5.99mm x 1.45mm) provides a compact footprint, while its 0.05W (1/20) power rating per resistor and 100V maximum voltage rating ensure reliability in low-power, high-voltage applications.
GS8B013322FDT Features
- High Precision: ±1% absolute tolerance and ±0.5% ratio tolerance for accurate signal conditioning.
- Robust Construction: Ceramic case with thin-film resistors for stability and low noise.
- Wide Temperature Range: Operates from 70°C to 125°C with derated power, ideal for industrial environments.
- Compact & Durable: SOIC-C series package with gull-wing termination for secure surface mounting.
- Low TCR: ±100ppm/°C ensures minimal resistance drift under thermal stress.
- Bussed Configuration: Simplifies PCB layout in bus-line applications.
GS8B013322FDT Applications
This resistor network excels in:
- Analog Signal Processing: Precision voltage dividers and sensor interfaces.
- Industrial Control Systems: Stable performance in PLCs and motor drives.
- Medical Electronics: Low-noise circuits for diagnostic equipment.
- Automotive Electronics (non-automotive qualified): Auxiliary systems requiring tight tolerance networks.
- Test & Measurement Equipment: Calibration circuits and reference networks.
Conclusion of GS8B013322FDT
The GS8B013322FDT stands out for its precision, thermal stability, and compact design, making it a superior choice for engineers designing high-reliability circuits. While not PPAP or automotive-qualified, its ceramic construction and thin-film technology deliver exceptional performance in industrial, medical, and instrumentation applications. Its bussed architecture reduces component count, streamlining designs where space and accuracy are critical.



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