TT Electronics/IRC

GS8B013400JDT

GS8B013400JDT Description

The GS8B013400JDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications requiring stable resistance in compact surface-mount packages. This 16-pin narrow SOIC device integrates 15 bussed resistors, each with a 340Ω resistance and a ±5% absolute tolerance, ensuring consistent performance across multiple circuits. Built with thin-film technology, it delivers a low ±100ppm/°C temperature coefficient, minimizing resistance drift over its operating range of -70°C to +125°C. The SOIC-C series package features a gull-wing termination for reliable soldering, with a 0.8W total power rating (0.05W per resistor) and a 100V maximum voltage rating. Its ceramic case enhances thermal stability, while the ±0.5% ratio tolerance between resistors makes it ideal for differential signal applications.

GS8B013400JDT Features

• 15 bussed resistors in a 16-pin SOIC package, optimizing PCB space.
• Thin-film technology for low noise and high stability (±100ppm/°C).
• 5% absolute tolerance and 0.5% ratio tolerance for precision matching.
• Wide temperature range (-70°C to +125°C) with derated power up to 125°C.
• 100V maximum voltage rating and 0.8W total power dissipation.
• Gull-wing termination for robust surface-mount assembly.
• Ceramic case for superior thermal performance and durability.
• Compact dimensions: 9.91mm (L) × 5.99mm (D) × 1.45mm (H).

GS8B013400JDT Applications

This resistor network excels in precision analog and digital circuits, including:

• Voltage dividers and current-limiting networks in industrial controls.
• Signal conditioning for sensors and transducers in automotive subsystems (non-AECQ qualified).
• Impedance matching in communication equipment.
• Medical devices requiring stable resistance under thermal stress.
• Test and measurement instruments where ratio tolerance is critical.

Conclusion of GS8B013400JDT

The GS8B013400JDT combines high density, precision, and thermal resilience in a compact SOIC package, making it a standout choice for space-constrained, high-reliability designs. Its thin-film construction, tight ratio tolerance, and ceramic encapsulation ensure long-term stability in harsh environments. While not PPAP or automotive-qualified, it is well-suited for industrial, medical, and telecom applications demanding consistent performance. Engineers will appreciate its balance of power handling, voltage tolerance, and miniaturized footprint, reducing BOM complexity without sacrificing accuracy.