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GS8B013572CCT
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GS8B013572CCT Description
GS8B013572CCT Description
The GS8B013572CCT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. This 16-pin narrow SOIC package features 15 bussed resistors with a 35.7KΩ resistance value and an exceptional ±0.25% absolute tolerance, ensuring consistent performance in precision circuits. Built with thin-film technology, it delivers stable operation across a wide temperature range (70°C to 125°C) and offers a ±100ppm/°C temperature coefficient, minimizing resistance drift. The SOIC-C series construction provides robust mechanical integrity, with a compact 9.91mm × 5.99mm × 1.45mm footprint, making it ideal for space-constrained designs. Rated for 100V maximum voltage and 0.8W total power dissipation, it balances high-density integration with reliable power handling.
GS8B013572CCT Features
- Precision Tolerance: ±0.25% absolute and ratio tolerance for matched performance.
- Stable Thin-Film Technology: Low noise and excellent long-term stability.
- Wide Temperature Range: Derated power operation up to 125°C.
- High-Density SOIC Package: 16-pin gull-wing termination with 1.27mm pitch for easy PCB integration.
- Bussed Network: Simplifies bus line termination in digital systems.
- Robust Ceramic Substrate: Superior thermal and mechanical resilience vs. polymer-based arrays.
- Non-Automotive Grade: Suitable for industrial, telecom, and instrumentation applications.
GS8B013572CCT Applications
- Voltage Division & Signal Conditioning: Precision dividers in ADC/DAC circuits.
- Bus Termination Networks: DDR memory, FPGA, and high-speed digital systems.
- Industrial Control Systems: PLCs, sensor interfaces, and feedback loops.
- Test & Measurement Equipment: Calibration circuits requiring tight tolerance.
- Aerospace & Defense: Ruggedized electronics where ceramic reliability is critical.
Conclusion of GS8B013572CCT
The GS8B013572CCT excels in applications demanding high precision, thermal stability, and compact integration. Its ceramic SOIC package and thin-film resistors outperform conventional networks in harsh environments, while the bussed design reduces component count in bus-oriented systems. Though not PPAP or automotive-qualified, it is a cost-effective solution for industrial and telecom designs where ±0.25% tolerance and ±100ppm/°C TCR are paramount. Engineers will value its balance of performance, density, and reliability in mission-critical circuits.



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