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GS8B013572DCT
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GS8B013572DCT Description
GS8B013572DCT Description
The GS8B013572DCT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding surface-mount applications. Packaged in a 16-pin narrow SOIC (SOIC-C Series), it integrates 15 bussed resistors with a 35.7KΩ resistance value and an absolute tolerance of ±0.5%, ensuring exceptional accuracy. The thin-film technology delivers a low temperature coefficient of ±100ppm/°C, maintaining stable performance across a wide temperature range of 70°C to 125°C. With a power rating of 0.8W (0.05W per resistor) and a maximum voltage rating of 100V, this network is engineered for reliability in precision circuits. Its gull-wing termination and compact dimensions (9.91mm x 5.99mm x 1.45mm) make it ideal for space-constrained designs.
GS8B013572DCT Features
- High Precision: ±0.5% absolute tolerance and ±0.25% ratio tolerance for critical applications.
- Robust Construction: Ceramic case ensures durability and thermal stability.
- Wide Operating Range: Functions reliably from 70°C to 125°C with derated power.
- Low TCR: ±100ppm/°C minimizes resistance drift under temperature fluctuations.
- Space-Efficient: SOIC package with 1.27mm terminal pitch optimizes PCB layout.
- Bussed Configuration: Simplifies circuit design by connecting multiple resistors in a single network.
- Surface-Mount Ready: Gull-wing terminals facilitate automated assembly processes.
GS8B013572DCT Applications
This resistor network excels in precision analog and digital circuits, including:
- Voltage dividers and signal conditioning in industrial control systems.
- Sensor interfaces requiring stable resistance ratios (e.g., thermocouples, strain gauges).
- Medical instrumentation where accuracy and thermal performance are critical.
- Automotive electronics (non-automotive grade but suitable for benign environments).
- Test and measurement equipment demanding tight tolerance and low drift.
Conclusion of GS8B013572DCT
The GS8B013572DCT stands out for its combination of precision, compactness, and thermal resilience, making it a superior choice for engineers designing high-reliability systems. While not PPAP or automotive-qualified, its ceramic construction and thin-film technology ensure consistent performance in industrial, medical, and instrumentation applications. Its bussed architecture reduces component count, streamlining both design and manufacturing. For projects requiring tight tolerance networks with robust thermal characteristics, this model delivers unmatched value.



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