TT Electronics/IRC

GS8B013572FDT

GS8B013572FDT Description

The GS8B013572FDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 35.7KΩ resistance value and a tight ±1% absolute tolerance, ensuring reliable signal integrity in demanding circuits. Encased in a rectangular SOIC package, it offers a compact footprint (9.91mm × 5.99mm × 1.45mm) with gull-wing terminations for secure surface mounting. The thin-film technology delivers excellent stability, with a ±100ppm/°C temperature coefficient and a 0.05W power rating per resistor (0.8W total). Rated for 100V maximum voltage and 125°C operating temperature, it suits industrial and instrumentation environments where precision and durability are critical.

GS8B013572FDT Features

• Bussed Network Design: 15 resistors connected in a bus configuration (Circuit Designator: BUS) for simplified PCB layout.
• High Precision: ±1% absolute tolerance and ±0.5% ratio tolerance for matched resistance values.
• Robust Construction: Ceramic case with thin-film technology ensures low noise and high thermal stability.
• Wide Temperature Range: Operates from 70°C to 125°C with derated power, ideal for harsh environments.
• Surface-Mount Ready: Gull-wing terminals with 1.27mm pitch for automated assembly compatibility.
• Non-Automotive Grade: Not PPAP-capable, but suitable for industrial and telecom applications.

GS8B013572FDT Applications

• Voltage Divider Networks: Precision attenuation in sensor interfaces or ADC circuits.
• Signal Conditioning: Stable resistance matching in instrumentation amplifiers.
• Industrial Control Systems: Durable performance in PLCs or motor drives.
• Telecom Hardware: Impedance matching in high-frequency communication modules.
• Test & Measurement Equipment: Reliable tolerance for calibration circuits.

Conclusion of GS8B013572FDT

The GS8B013572FDT excels in applications demanding tight tolerance, thermal stability, and compact design. Its ceramic SOIC package and bussed architecture reduce board space while maintaining performance under high voltages and temperatures. While not RoHS-compliant or automotive-grade, it is a cost-effective solution for industrial, telecom, and precision electronics. Engineers will appreciate its low TCR, high power rating, and ease of integration in surface-mount designs.