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GS8B013572GFT
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GS8B013572GFT Description
GS8B013572GFT Description
The GS8B013572GFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. Housed in a 16-pin narrow SOIC package, this bussed network integrates 15 thin-film resistors with a 35.7KΩ resistance value and a tight ±2% absolute tolerance. Its ±100ppm/°C temperature coefficient ensures stable performance across a wide temperature range (70°C to 125°C). The device features gull-wing terminations for reliable surface-mount assembly and operates at a maximum voltage rating of 100V, with a power rating of 0.8W (0.05W per resistor). The SOIC-C series construction offers robust mechanical and thermal stability, making it ideal for compact, high-density PCB designs.
GS8B013572GFT Features
- Ceramic substrate for superior thermal management and durability.
- Thin-film technology ensures low noise and high precision (±1% ratio tolerance).
- Bussed configuration simplifies circuit design for common-node applications.
- Wide operating temperature range (up to 125°C) with derated power handling.
- Narrow SOIC (5.99mm × 9.91mm) footprint saves board space.
- Gull-wing leads enhance solder joint reliability in automated assembly.
- Non-automotive, non-PPAP compliant, suited for industrial and commercial use.
- Non-RoHS (contains lead), ideal for legacy or high-reliability systems.
GS8B013572GFT Applications
This resistor network excels in:
- Voltage divider networks and signal conditioning circuits requiring matched resistors.
- Precision analog systems (e.g., instrumentation amplifiers, DAC/ADC interfaces).
- Power supply feedback loops where stability and low TCR are critical.
- Industrial control systems exposed to elevated temperatures.
- Legacy electronics requiring leaded components for compliance or repair.
Conclusion of GS8B013572GFT
The GS8B013572GFT stands out for its ceramic-based construction, tight tolerances, and robust thermal performance, making it a reliable choice for precision analog and power management applications. While not suited for automotive or RoHS-compliant designs, its bussed architecture and thin-film technology offer distinct advantages in industrial and high-temperature environments. Engineers will appreciate its space-saving SOIC package and consistent performance under derated power conditions.



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