TT Electronics/IRC

GS8B013600CBT

GS8B013600CBT Description

The GS8B013600CBT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding surface-mount applications. This 16-pin narrow SOIC package features 15 bussed resistors with a 360Ω resistance value and an exceptional ±0.25% absolute tolerance (±0.1% ratio tolerance). Built with thin-film technology, it offers a ±100ppm/°C temperature coefficient, ensuring stable performance across a -70°C to +125°C operating range. The SOIC-C series construction provides 0.05W (1/20) power rating per resistor (0.8W total), with a 100V maximum voltage rating, making it suitable for precision analog and digital circuits.

GS8B013600CBT Features

• Ceramic Case & Thin Film Tech: Ensures low noise, high stability, and reliability in harsh environments.
• Ultra-Tight Tolerance: ±0.25% absolute (±0.1% ratio) for precision voltage division and signal conditioning.
• Wide Temp Range: Operates from -70°C to +125°C with derated power up to 125°C.
• Robust Packaging: 16-pin SOIC with gull-wing leads for secure surface-mount assembly.
• Bussed Network: Simplifies bus termination, pull-up/down, and impedance matching in multi-channel systems.
• Non-Automotive (PPAP No): Ideal for industrial, telecom, and test equipment where precision is critical.

GS8B013600CBT Applications

• Analog/Digital Signal Processing: Precision dividers, DAC/ADC interfaces, and sensor conditioning.
• Bus Termination: I²C, SPI, or parallel data lines requiring matched impedance.
• Power Management: Voltage reference networks in DC-DC converters or LDOs.
• Test & Measurement: Calibration circuits demanding low drift over temperature.
• Industrial Controls: PLC I/O modules where ceramic durability resists vibration/thermal stress.

Conclusion of GS8B013600CBT

The GS8B013600CBT excels in precision, thermal stability, and compact integration, outperforming generic resistor arrays with its ceramic substrate and thin-film accuracy. While non-RoHS and unconfirmed for automotive use, its 0.8W total power handling and ±100ppm/°C TCR make it a top choice for high-reliability industrial and communication systems. Engineers will value its SOIC footprint compatibility and bussed topology for simplifying PCB layouts in multi-channel designs.