TT Electronics/IRC

GS8B013650JDT

GS8B013650JDT Description

The GS8B013650JDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Packaged in a 16-pin narrow SOIC (SOIC-C Series), this device integrates 15 bussed resistors with a 365Ω resistance value and a ±5% absolute tolerance, ensuring consistent performance. Its thin-film technology delivers excellent stability with a ±100ppm/°C temperature coefficient, making it suitable for environments with fluctuating thermal conditions. The network operates within a temperature range of 70°C to 125°C and supports a maximum voltage rating of 100V, with a power rating of 0.8W (0.05W per resistor). The gull-wing termination and surface-mount design facilitate easy PCB integration, while the ceramic case ensures durability and thermal resistance.

GS8B013650JDT Features

• High-Density Integration: 15 resistors in a compact 9.91mm × 5.99mm × 1.45mm SOIC package.
• Precision Performance: ±5% tolerance with ±0.5% ratio tolerance for matched resistance values.
• Robust Construction: Ceramic substrate enhances thermal and mechanical stability.
• Wide Operating Range: Functions reliably from -55°C to 125°C (derated power up to 125°C).
• Surface-Mount Ready: Gull-wing leads and 1.27mm terminal pitch for seamless PCB assembly.
• Low TCR: ±100ppm/°C ensures minimal resistance drift under temperature variations.
• Non-Automotive Grade: Ideal for industrial, telecom, and instrumentation applications.

GS8B013650JDT Applications

• Voltage Divider Networks: Precision division in analog signal conditioning.
• Pull-Up/Pull-Down Resistor Arrays: Digital logic circuits requiring matched impedances.
• Sensor Interface Modules: Stable biasing for thermocouples, RTDs, and strain gauges.
• Industrial Control Systems: Reliable performance in harsh environments.
• Telecommunication Equipment: Signal termination and impedance matching in high-frequency PCBs.

Conclusion of GS8B013650JDT

The GS8B013650JDT excels in applications demanding high-density, precision resistance networks with robust thermal performance. Its ceramic construction, tight tolerance, and low TCR make it a superior choice over polymer-based arrays in high-reliability systems. While not PPAP or automotive-qualified, it is well-suited for industrial, medical, and telecom designs where stability and compactness are critical. Engineers will appreciate its balance of performance, durability, and ease of integration in space-constrained layouts.