TT Electronics/IRC

GS8B013900FCT

GS8B013900FCT Description

The GS8B013900FCT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Housed in a 16-pin narrow SOIC package, it features 15 bussed resistors with a 390Ω resistance value and a tight ±1% absolute tolerance, ensuring reliable signal integrity. Built with thin-film technology, it offers a low ±100ppm/°C temperature coefficient, making it stable across a wide operating range of -70°C to +125°C. The SOIC-C series construction provides robust thermal and mechanical performance, with a 0.05W (1/20) power rating per resistor and a total power rating of 0.8W. Its gull-wing termination and surface-mount design facilitate easy PCB integration.

GS8B013900FCT Features

• Ceramic case for enhanced durability and heat dissipation.
• Bussed network topology simplifies circuit design in multi-resistor applications.
• 1.27mm terminal pitch and compact dimensions (9.91mm x 5.99mm x 1.45mm) save board space.
• High voltage rating (100V) and low TCR (±100ppm/°C) ensure stability in harsh environments.
• Non-automotive (PPAP: No) but suitable for industrial and telecom applications.
• EU RoHS non-compliant, requiring careful consideration for regulated markets.

GS8B013900FCT Applications

This resistor network excels in precision analog circuits, voltage dividers, and bus termination where tight tolerance (±1%) and thermal stability are critical. Its high-temperature resilience (125°C max) makes it ideal for power supplies, instrumentation, and communication hardware. The bussed configuration is particularly useful in digital logic circuits, ADC/DAC interfaces, and sensor signal conditioning.

Conclusion of GS8B013900FCT

The GS8B013900FCT stands out for its ceramic construction, low TCR, and high power density, offering superior reliability in demanding applications. While not RoHS-compliant, its performance-to-size ratio and precision tolerances make it a compelling choice for engineers designing high-stability, space-constrained systems. Its SOIC packaging ensures compatibility with automated assembly processes, reducing manufacturing complexity.