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GS8B014302JFT
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GS8B014302JFT Description
GS8B014302JFT Description
The GS8B014302JFT from TT Electronics/IRC is a high-reliability ceramic resistor network designed for precision applications. Packaged in a 16-pin narrow SOIC (SOIC-C series), it features 15 bussed resistors with a 43KΩ resistance value and ±5% absolute tolerance. Built using thin-film technology, it delivers stable performance with a ±100ppm/°C temperature coefficient, ensuring minimal resistance drift across its operating range of -70°C to +125°C. The network supports a maximum voltage rating of 100V and offers a power rating of 0.8W (0.05W per resistor), making it suitable for moderate-power circuits. Its gull-wing termination and surface-mount design facilitate easy PCB integration, while the ceramic case enhances thermal and mechanical durability.
GS8B014302JFT Features
- Bussed Network Configuration: 15 resistors connected in a bus topology, ideal for voltage division or pull-up/down applications.
- High-Temperature Stability: Operates reliably up to 125°C with derated power performance.
- Precision Thin Film: Low TCR (±100ppm/°C) and tight ratio tolerance (±1%) for consistent signal integrity.
- Robust Packaging: Ceramic SOIC case (9.91mm × 5.99mm × 1.45mm) with ±0.1mm dimensional tolerances, ensuring mechanical resilience.
- Surface-Mount Ready: Gull-wing leads with 1.27mm pitch for automated assembly compatibility.
- Non-Automotive Grade: Suitable for industrial, telecom, and instrumentation use (PPAP not required).
GS8B014302JFT Applications
- Voltage Dividers: Precision ladder networks in ADC/DAC circuits.
- Pull-Up/Pull-Down Arrays: Signal conditioning in digital logic (e.g., I²C buses).
- Industrial Controls: Sensor interfaces, PLCs, and power management modules.
- Telecom Equipment: Line termination and impedance matching in high-frequency PCBs.
- Test & Measurement: Calibration circuits requiring stable resistance ratios.
Conclusion of GS8B014302JFT
The GS8B014302JFT excels in environments demanding thermal stability, compact integration, and moderate power handling. Its ceramic construction and thin-film technology provide superior performance over polymer-based networks, particularly in high-temperature or precision-critical designs. While not RoHS-compliant, it remains a cost-effective choice for industrial and telecom applications where reliability outweighs regulatory constraints. Engineers will appreciate its balanced trade-off between tolerance, power rating, and footprint, making it a versatile solution for embedded systems and analog signal processing.



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