TT Electronics/IRC

GS8B014752JCT

GS8B014752JCT Description

The GS8B014752JCT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Housed in a 16-pin narrow SOIC package, it features 15 bussed resistors with a 47.5KΩ resistance value and a ±5% absolute tolerance. The device operates over a wide temperature range of -70°C to +125°C, making it suitable for demanding environments. Its thin-film technology ensures stable performance with a ±100ppm/°C temperature coefficient, while the 0.05W (1/20) power rating per resistor and 0.8W total power rating provide reliable power dissipation. The 100V maximum voltage rating and gull-wing termination further enhance its versatility for surface-mount applications.

GS8B014752JCT Features

• Ceramic Case & Thin Film Technology: Ensures high stability, low noise, and excellent thermal performance.
• Bussed Network (BUS): Simplifies circuit design by connecting multiple resistors in a single package.
• Precision Tolerance: ±5% absolute tolerance and ±0.25% ratio tolerance for accurate signal conditioning.
• Robust Construction: SOIC package with 9.91mm length, 5.99mm depth, and 1.45mm height, featuring tight tolerances (±0.1mm height, ±0.2mm depth).
• Wide Operating Range: Functions reliably from -70°C to +125°C, ideal for industrial and automotive (non-PPAP) applications.
• Surface-Mount Design: Gull-wing terminals with 1.27mm pitch for easy PCB integration.

GS8B014752JCT Applications

This resistor network excels in:

• Voltage Division & Signal Conditioning: Precision networks for ADC/DAC reference circuits.
• Industrial Control Systems: Stable performance in harsh environments (e.g., PLCs, sensors).
• Consumer Electronics: Space-saving solution for compact designs like smart home devices.
• Test & Measurement Equipment: Low-drift performance ensures accuracy in instrumentation.
• Power Management: Bussed configuration simplifies bias networks in power supplies.

Conclusion of GS8B014752JCT

The GS8B014752JCT combines high precision, robust packaging, and thermal stability, making it a superior choice for engineers seeking reliability in compact designs. Its ceramic construction, thin-film technology, and bussed architecture offer distinct advantages over polymer-based or discrete alternatives. While not RoHS-compliant, its performance in extreme temperatures and precision-critical applications justifies its use in industrial, automotive (non-PPAP), and high-end consumer electronics. Ideal for designs demanding tight tolerances, low thermal drift, and space efficiency.