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GS8B015230JGT
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GS8B015230JGT Description
GS8B015230JGT Description
The GS8B015230JGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 16-pin narrow SOIC package features 15 bussed resistors with a 523Ω resistance value and a ±5% absolute tolerance, ensuring reliable performance in voltage division and bus termination applications. Its thin-film technology delivers excellent stability with a ±100ppm/°C temperature coefficient, making it suitable for environments with fluctuating thermal conditions. The device operates within a -70°C to +125°C temperature range and offers a 0.8W total power rating (0.05W per resistor), with a 100V maximum voltage rating. Encased in a rectangular ceramic SOIC package, it provides robust mechanical and thermal durability.
GS8B015230JGT Features
- High-Density Integration: 15 resistors in a compact 9.91mm × 5.99mm × 1.45mm SOIC package.
- Precision Performance: ±5% tolerance and ±2% ratio tolerance for consistent signal integrity.
- Thermal Stability: ±100ppm/°C TCR ensures minimal resistance drift.
- Robust Construction: Ceramic case enhances heat dissipation and mechanical strength.
- Surface-Mount Design: Gull-wing termination with 1.27mm pitch for easy PCB assembly.
- Wide Operating Range: Functions reliably from -70°C to +125°C, derated at higher temperatures.
GS8B015230JGT Applications
Ideal for industrial, telecommunications, and instrumentation systems, this resistor network excels in:
- Voltage divider networks requiring tight tolerance ratios.
- Bus termination in high-speed digital circuits (e.g., memory modules, FPGA interfaces).
- Signal conditioning for sensors and analog front-end designs.
- Automotive-grade alternatives (though not PPAP-certified) in non-safety-critical roles.
Its low thermal EMF and high power density make it preferable over discrete resistors in space-constrained designs.
Conclusion of GS8B015230JGT
The GS8B015230JGT combines precision, durability, and compact integration, addressing challenges in modern electronics where space and thermal management are critical. While not RoHS-compliant, its ceramic construction and thin-film technology offer superior performance in harsh environments. Engineers will value its balance of cost, reliability, and density for bus-oriented and analog signal applications. For designs demanding stable, high-density resistor networks, this model stands out as a robust solution.



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