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GS8B0152R3GDT
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GS8B0152R3GDT Description
GS8B0152R3GDT Description
The GS8B0152R3GDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Packaged in a 16-pin narrow SOIC (SOIC-C series), this bussed network integrates 15 resistors with a common 52.3Ω resistance value, offering a ±2% absolute tolerance and ±0.5% ratio tolerance. Its thin-film technology ensures stable performance with a ±100ppm/°C temperature coefficient, making it suitable for environments with fluctuating thermal conditions. The device operates within a -70°C to +125°C temperature range and supports a maximum voltage rating of 100V, with a 0.05W (1/20W) power rating per resistor and 0.8W total power dissipation.
GS8B0152R3GDT Features
- Ceramic Construction: Enhances thermal stability and durability in harsh environments.
- Bussed Network Design: Simplifies circuit layout by connecting multiple resistors to a common node (BUS).
- Precision Tolerance: ±2% absolute and ±0.5% ratio tolerance for consistent performance in matched circuits.
- Wide Temperature Range: Operates from -70°C to +125°C, with derated power up to 125°C.
- Surface-Mount Gull Wing Terminals: Ensures reliable SMT compatibility with a 1.27mm terminal pitch.
- Low TCR: ±100ppm/°C minimizes resistance drift over temperature variations.
- Compact Dimensions: 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
GS8B0152R3GDT Applications
This resistor network is ideal for:
- Voltage Divider Networks: Precision dividers in analog signal conditioning.
- Bus Termination: Impedance matching in high-speed digital circuits (e.g., memory buses).
- Sensor Interface Circuits: Stable reference resistors for RTDs or bridge networks.
- Industrial Controls: Robust performance in PLCs, motor drives, and power supplies.
- Automotive Electronics: Non-automotive grade but suitable for benign-environment automotive subsystems.
Conclusion of GS8B0152R3GDT
The GS8B0152R3GDT excels in applications requiring tight tolerance, thermal stability, and compact integration. Its ceramic substrate, bussed architecture, and thin-film technology provide superior reliability compared to standard epoxy-based networks. While not RoHS-compliant, it remains a cost-effective solution for industrial and instrumentation designs where precision and durability are critical. Engineers will appreciate its balance of performance, size, and power handling in space-constrained, high-reliability systems.



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