TT Electronics/IRC

GS8B015360GGT

GS8B015360GGT Description

The GS8B015360GGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Housed in a 16-pin narrow SOIC package, this bussed (BUS) network integrates 15 thin-film resistors, each with a 536Ω resistance value and a tight ±2% absolute tolerance. Its ±100ppm/°C temperature coefficient ensures stable performance across a wide operating temperature range of -70°C to +125°C. With a 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating, it balances power handling and compactness (9.91mm × 5.99mm × 1.45mm). The gull-wing termination and surface-mount design facilitate automated assembly, while the ceramic case enhances thermal and mechanical reliability.

GS8B015360GGT Features

• High-Density Integration: 15 resistors in a compact SOIC-C series package (16-pin) with 1.27mm terminal pitch.
• Stable Thin-Film Technology: Delivers low noise and high accuracy (±2% ratio tolerance) for signal conditioning.
• Robust Construction: Ceramic substrate ensures superior thermal conductivity and durability in harsh environments.
• Wide Temperature Range: Operates reliably from -70°C to +125°C with derated power up to 125°C.
• Automation-Friendly: Gull-wing leads and ±0.1mm height tolerance simplify PCB mounting and reflow processes.
• Non-Automotive: Suitable for industrial and commercial applications where PPAP compliance is not required.

GS8B015360GGT Applications

• Voltage Division & Pull-Up Networks: Ideal for ADC/DAC circuits and microcontroller I/O interfaces due to precise ratio tolerance.
• Signal Conditioning: Used in sensor arrays, medical instrumentation, and test equipment where stability is critical.
• Power Management: Supports load sharing and bias networks in power supplies and DC-DC converters.
• Industrial Controls: Resilient in factory automation systems exposed to temperature fluctuations.

Conclusion of GS8B015360GGT

The GS8B015360GGT excels in space-constrained, high-reliability designs, offering a blend of precision, thermal resilience, and compact integration. Its ceramic thin-film construction and bussed architecture make it a superior choice over polymer-based networks in high-temperature or precision analog applications. While not RoHS-compliant, it remains a cost-effective solution for industrial, telecom, and instrumentation markets requiring robust performance without automotive-grade certifications. Engineers will appreciate its repeatable accuracy and ease of assembly in volume production.