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GS8B015621GGT
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GS8B015621GGT Description
GS8B015621GGT Description
The GS8B015621GGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Packaged in a 16-pin narrow SOIC (SOIC-C Series), it features 15 bussed resistors with a 5.62KΩ resistance value and a tight ±2% absolute tolerance. The thin-film technology ensures low noise and stable performance, while the ±100ppm/°C temperature coefficient guarantees reliability across a wide operating temperature range of -70°C to +125°C. With a 0.05W (1/20) power rating per resistor and a total power rating of 0.8W, this network is ideal for demanding circuits requiring consistent performance under varying thermal conditions.
GS8B015621GGT Features
- Ceramic Case & Thin Film Technology: Ensures high durability and thermal stability in harsh environments.
- Bussed Network (BUS): Simplifies circuit design by connecting multiple resistors in a single package.
- Precision Tolerance: ±2% absolute and ratio tolerance for accurate signal conditioning.
- Wide Voltage & Temperature Range: Supports up to 100V and operates reliably from -70°C to +125°C.
- Compact SOIC Package: 9.91mm length, 5.99mm depth, and 1.45mm height with gull-wing termination for easy surface mounting.
- Non-Automotive & Non-PPAP: Suitable for industrial and commercial applications where PPAP compliance is not required.
GS8B015621GGT Applications
This resistor network excels in:
- Signal Conditioning & Voltage Division: Precision networks for ADC/DAC circuits and sensor interfaces.
- Industrial Control Systems: Stable performance in PLC modules, motor drives, and power supplies.
- Telecommunications: Impedance matching and filtering in RF and baseband circuits.
- Test & Measurement Equipment: High-accuracy resistance networks for calibration and instrumentation.
- Consumer Electronics: Compact footprint ideal for portable devices and embedded systems.
Conclusion of GS8B015621GGT
The GS8B015621GGT stands out for its ceramic construction, precision tolerances, and robust thermal performance, making it a superior choice for high-reliability applications. While not RoHS-compliant, its thin-film technology and bussed design reduce board space and simplify assembly. Engineers will appreciate its balance of accuracy, power handling, and compact form factor, particularly in industrial, telecom, and instrumentation designs where consistent performance is critical.



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