TT Electronics/IRC

GS8B0160R4DT

GS8B0160R4DT Description

The GS8B0160R4DT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 16-pin narrow SOIC package, this bussed (BUS) configuration device integrates 15 thin-film resistors, each with a 60.4Ω resistance and an exceptional ±0.5% absolute tolerance. Its ±100ppm/°C temperature coefficient ensures stable performance across a wide operating temperature range of 70°C to 125°C, derated for optimal reliability. The SOIC-C series construction features a rectangular ceramic case with gull-wing terminations, offering robust mechanical and thermal stability for surface-mount applications. With a maximum voltage rating of 100V and a total power dissipation of 0.8W (0.05W per resistor), this network is engineered for precision and durability.

GS8B0160R4DT Features

• High Precision: ±0.5% tolerance and ±100ppm/°C TCR for consistent performance in critical circuits.
• Robust Construction: Ceramic substrate and thin-film technology enhance thermal management and longevity.
• Space-Efficient Design: Compact 9.91mm × 5.99mm × 1.45mm footprint with 1.27mm terminal pitch suits high-density PCB layouts.
• Wide Operating Range: Rated for -55°C to +125°C, with derated power up to 125°C.
• Bussed Topology: Simplifies circuit design by interconnecting resistors, reducing external wiring.
• Surface-Mount Ready: Gull-wing terminations facilitate automated assembly processes.

GS8B0160R4DT Applications

Ideal for precision analog and digital systems, the GS8B0160R4DT excels in:

• Voltage Division & Signal Conditioning: Precision dividers in sensor interfaces or ADC/DAC circuits.
• Bus Termination Networks: EMI reduction and impedance matching in high-speed data lines (e.g., CAN, LVDS).
• Industrial Controls: Stable performance in harsh environments (e.g., motor drives, power supplies).
• Test & Measurement Equipment: Low-drift resistance networks for calibration and reference circuits.
• Aerospace & Defense: Reliable operation in extended temperature ranges and high-vibration settings.

Conclusion of GS8B0160R4DT

The GS8B0160R4DT combines precision, reliability, and compactness, making it a superior choice for applications requiring tight tolerance and thermal stability. Its ceramic SOIC package and bussed architecture offer design flexibility and robustness, outperforming standard epoxy-based networks in high-temperature or precision-critical scenarios. While not RoHS-compliant, its performance metrics cater to specialized industrial, automotive (non-PPAP), and aerospace needs where accuracy and durability are paramount.