TT Electronics/IRC

GS8B016190FCT

GS8B016190FCT Description

The GS8B016190FCT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Packaged in a 16-pin narrow SOIC (SOIC-C series), it features 15 bussed resistors with a 619Ω resistance value and a tight ±1% absolute tolerance, ensuring reliable signal integrity. The thin-film technology delivers excellent stability with a ±100ppm/°C temperature coefficient, making it ideal for environments with operating temperatures ranging from 70°C to 125°C. With a 0.8W total power rating (0.05W per resistor) and a 100V maximum voltage rating, this network is built for durability in demanding circuits.

GS8B016190FCT Features

• Ceramic case for superior thermal and mechanical stability.
• Bussed (BUS) configuration simplifies circuit design in multi-resistor applications.
• 1.27mm terminal pitch and gull-wing termination for easy surface-mount assembly.
• Compact dimensions: 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm L/H, ±0.2mm D).
• High power density: 0.8W total dissipation in a small footprint.
• Non-automotive grade (PPAP: No), suited for industrial and commercial use.
• Non-RoHS compliant, offering flexibility for legacy or specialized applications.

GS8B016190FCT Applications

This resistor network excels in:

• Voltage division and bus termination in digital communication systems.
• Precision analog circuits requiring stable resistance ratios (±0.25% ratio tolerance).
• Embedded control systems where space efficiency and thermal performance are critical.
• Test and measurement equipment demanding low drift over temperature.
• Power management modules in industrial automation, leveraging its high-voltage capability.

Conclusion of GS8B016190FCT

The GS8B016190FCT stands out for its ceramic construction, tight tolerances, and bussed architecture, making it a robust choice for engineers prioritizing precision and reliability. While not suited for automotive use, its thin-film technology and high-temperature resilience make it ideal for industrial, telecom, and instrumentation applications. Its compact SOIC package ensures compatibility with high-density PCB designs, offering a balance of performance and space savings.