TT Electronics/IRC

GS8B016342FDT

GS8B016342FDT Description

The GS8B016342FDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Packaged in a 16-pin narrow SOIC (SOIC-C series), it features 15 bussed resistors with a 63.4KΩ resistance value and a tight ±1% absolute tolerance. The device operates over a wide temperature range of 70°C to 125°C with a derated power rating, ensuring reliability in demanding environments. Its thin-film technology and ±100ppm/°C temperature coefficient provide excellent stability and low drift. The 0.05W (1/20) power rating per resistor and 0.8W total power rating make it suitable for low-power circuits. With a 100V maximum voltage rating and gull-wing termination, it is optimized for surface-mount applications.

GS8B016342FDT Features

• Ceramic case (SOIC package) for enhanced thermal and mechanical stability.
• Bussed network topology simplifies circuit design in multi-resistor applications.
• High precision: ±1% absolute tolerance and ±0.5% ratio tolerance for matched performance.
• Wide operating range: -55°C to +125°C (full power up to 70°C).
• Low TCR (±100ppm/°C) ensures minimal resistance variation with temperature.
• Compact dimensions: 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• RoHS non-compliant, making it suitable for legacy or specialized industrial systems.

GS8B016342FDT Applications

This resistor network excels in:

• Analog signal conditioning in instrumentation and measurement systems.
• Voltage divider networks requiring matched resistor ratios.
• Industrial control systems where stability under thermal stress is critical.
• Automotive electronics (non-AECQ qualified, suitable for non-safety-critical functions).
• Embedded systems needing compact, high-density resistor arrays.

Conclusion of GS8B016342FDT

The GS8B016342FDT combines precision, reliability, and compact design, making it ideal for applications demanding tight tolerance and thermal stability. Its ceramic construction and thin-film technology offer superior performance over polymer-based networks, while the bussed configuration reduces PCB footprint. Though not PPAP or automotive-qualified, it is a robust choice for industrial, medical, and test equipment where consistent performance is paramount.