TT Electronics/IRC

GS8B0164R9FT

GS8B0164R9FT Description

The GS8B0164R9FT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 16-pin narrow SOIC device features 15 bussed resistors with a 64.9Ω resistance value and a tight ±1% tolerance, ensuring consistent performance across varying conditions. Built with thin-film technology, it offers excellent stability and low noise, making it ideal for signal conditioning, voltage division, and bus termination. The SOIC-C series package provides robust mechanical protection and reliable surface-mount compatibility, while its ceramic case ensures superior thermal management.

GS8B0164R9FT Features

• High Precision: ±1% absolute tolerance and ±100ppm/°C temperature coefficient for stable operation.
• Robust Construction: Ceramic case enhances durability and heat dissipation.
• Compact Design: Measures 9.91mm (L) x 5.99mm (D) x 1.45mm (H) with a 1.27mm terminal pitch, saving PCB space.
• Power Handling: 0.05W per resistor (0.8W total) with derating up to 125°C.
• Bussed Configuration: Simplifies circuit design by connecting multiple resistors to a common node.
• Wide Voltage Range: Supports up to 100V, suitable for industrial and telecom applications.

GS8B0164R9FT Applications

This resistor network excels in:

• Analog/Digital Signal Processing: Precision voltage dividers and bus termination in ADCs/DACs.
• Industrial Controls: Reliable performance in PLCs, motor drives, and power supplies.
• Telecommunications: Signal integrity in high-speed data lines and RF modules.
• Automotive Electronics: Despite not being PPAP/AEC-Q200 qualified, it suits non-safety-critical automotive subsystems.
• Test & Measurement Equipment: Stable resistance for calibration and sensor interfaces.

Conclusion of GS8B0164R9FT

The GS8B0164R9FT stands out for its precision, compactness, and thermal resilience, making it a superior choice for engineers needing reliable resistor networks in space-constrained, high-temperature environments. Its bussed architecture reduces component count, while thin-film technology ensures long-term stability. While not RoHS-compliant, it remains a cost-effective solution for industrial and telecom designs requiring tight tolerances and robust performance.