TT Electronics/IRC

GS8B016800GFT

GS8B016800GFT Description

The GS8B016800GFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 16-pin narrow SOIC (SOIC-C series) device integrates 15 bussed resistors, each with a 680Ω resistance value and a tight ±2% absolute tolerance (±1% ratio tolerance). Built with thin-film technology, it delivers excellent stability with a low ±100ppm/°C temperature coefficient, ensuring reliable performance across a -70°C to +125°C operating range. The 0.05W (1/20) power rating per resistor and 100V maximum voltage rating make it suitable for low-power, high-voltage environments. Encased in a rectangular ceramic package, it offers superior thermal and mechanical durability compared to polymer-based alternatives.

GS8B016800GFT Features

• Bussed Network Design: 15 resistors connected in a bus configuration, simplifying PCB layout for shared voltage applications.
• High Precision: ±2% tolerance and ±100ppm/°C TCR ensure minimal drift in critical circuits.
• Robust Construction: Ceramic case (SOIC package) with gull-wing termination, resistant to thermal stress and vibration.
• Space-Efficient: Compact 9.91mm × 5.99mm × 1.45mm footprint, ideal for high-density designs.
• Wide Temperature Range: Operates from -70°C to +125°C with derated power up to 125°C.
• Surface-Mount Ready: 1.27mm terminal pitch for compatibility with automated assembly processes.

GS8B016800GFT Applications

• Voltage Division/Current Limiting: Precision networks in ADC/DAC circuits, sensor interfaces, and signal conditioning.
• Industrial Electronics: Harsh-environment applications like motor controls, power supplies, and instrumentation.
• Automotive (Non-Automotive Rated): Prototyping or non-safety-critical systems requiring stable resistance.
• Telecom/Networking: Termination resistors for high-speed data lines (within voltage/power limits).

Conclusion of GS8B016800GFT

The GS8B016800GFT stands out for its ceramic-based reliability, tight tolerance, and bussed architecture, making it a superior choice over plastic-encased networks in thermally challenging or precision-critical designs. While not PPAP or automotive-qualified, its thin-film technology and wide operational range cater to industrial, telecom, and prototyping needs where durability and accuracy are paramount. Its SOIC-16 package balances performance with manufacturability, offering a robust solution for engineers prioritizing long-term stability in compact layouts.