TT Electronics/IRC

GS8B016800JCT

GS8B016800JCT Description

The GS8B016800JCT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Housed in a 16-pin narrow SOIC package, this bussed network integrates 15 thin-film resistors, each with a 680Ω resistance and a ±5% absolute tolerance. The device operates over a wide temperature range (-55°C to +125°C) with a derated power range of 70°C to 125°C, ensuring reliability in thermally challenging environments. With a ±100ppm/°C temperature coefficient and a 0.8W total power rating, it offers stable performance under varying conditions. The SOIC-C series construction provides robust mechanical and thermal properties, making it ideal for surface-mount applications requiring compact, high-density resistor arrays.

GS8B016800JCT Features

• Ceramic substrate for enhanced thermal stability and durability.
• Thin-film technology ensures low noise and high precision (±0.25% ratio tolerance).
• Bussed (BUS) configuration simplifies circuit design by interconnecting resistors.
• Gull-wing termination for reliable surface-mount soldering.
• 100V maximum voltage rating and 0.05W (1/20W) power rating per resistor.
• Compact dimensions (9.91mm x 5.99mm x 1.45mm) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• Non-automotive grade with PPAP: No, suitable for industrial and commercial applications.

GS8B016800JCT Applications

This resistor network excels in:

• Voltage division and pull-up/down circuits in digital systems.
• Signal conditioning for sensors and analog front-ends.
• Embedded systems requiring space-efficient, high-density passive components.
• Test and measurement equipment where precision and thermal stability are critical.
• Power management modules in telecom and computing hardware.

Conclusion of GS8B016800JCT

The GS8B016800JCT stands out for its ceramic construction, thin-film precision, and bussed topology, offering superior performance in compact designs. While not RoHS-compliant, its high power density, tight tolerances, and wide operating range make it a preferred choice for engineers prioritizing reliability in industrial and commercial electronics. Its SOIC packaging ensures compatibility with automated assembly processes, reducing manufacturing complexity. Ideal for applications demanding stable resistance networks under thermal stress, this component delivers consistent performance where lesser alternatives may falter.