


TT Electronics/IRC
GS8B016801FDT
Why Choose Us?
Professional Platform
B2B & B2C purchasingDelivery at full speed
1-2 days deliveryWide variety
Original manufacturers365 days guarantee
Responsible qualityTech Specifications
GS8B016801FDT Description
GS8B016801FDT Description
The GS8B016801FDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Packaged in a 16-pin narrow SOIC (SOIC-C series), it features 15 bussed resistors with a 6.8KΩ resistance value and a tight ±1% absolute tolerance (±0.5% ratio tolerance). Built using thin-film technology, it delivers excellent stability with a ±100ppm/°C temperature coefficient. The device operates over a wide temperature range of 70°C to 125°C (derated) and withstands up to 125°C maximum operating temperature. With a 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating, it is ideal for demanding circuits requiring reliability and precision.
GS8B016801FDT Features
- Ceramic case ensures durability and thermal stability.
- Gull-wing termination for secure surface-mount (SMD) assembly.
- Compact dimensions: 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
- Bussed network design simplifies PCB layout for bus line termination and voltage division.
- Low TCR (±100ppm/°C) minimizes resistance drift under thermal stress.
- Non-automotive grade (PPAP: No) but suitable for industrial and telecom applications.
- Non-RoHS compliant, making it suitable for legacy or specialized systems.
GS8B016801FDT Applications
This resistor network excels in:
- Analog and digital signal conditioning in measurement equipment.
- Bus termination for high-speed data lines (e.g., SPI, I²C).
- Voltage divider networks in power supplies and sensor interfaces.
- Industrial control systems requiring stable, high-density resistance solutions.
- Telecommunication hardware where precision and thermal performance are critical.
Conclusion of GS8B016801FDT
The GS8B016801FDT combines thin-film precision, robust ceramic construction, and compact SOIC packaging to address complex circuit design challenges. Its bussed architecture, low TCR, and 1% tolerance make it a reliable choice for engineers prioritizing accuracy and thermal resilience. While not suited for automotive use, it is a cost-effective solution for industrial, telecom, and instrumentation applications demanding high-density resistor networks.



.png)














.png?x-oss-process=image/format,webp/resize,h_32)










